Electronics Forum: acoustical (Page 1 of 3)

CSAM Machines

Electronics Forum | Wed Mar 01 07:45:56 EST 2006 | davef

Consider: * Equipment Inspection acoustic microscope [Scanning Acoustic Microscopy (SAM)] MicroPhotonics 4949 Liberty Lane, Suite 160, PO Box 3129 Allentown PA 18106 610.366.7103 fax 7105 http://www.microphotonics.com * Equipment Inspection acoustic

Ultrasonic detector instead of X-ray

Electronics Forum | Wed Apr 14 14:48:48 EDT 2010 | davef

It won't work. An acoustic signal can't punch through a BGA. The signals reflect at every interface. So, it works for flip chip, but there are too many interfaces in CSP and BGA. Equipment, Inspection, Acoustic microscope * MicroPhotonics * Sonos

Voiding in Underfill process

Electronics Forum | Mon Jan 21 15:45:05 EST 2008 | davef

Yes. It's called a surface acoustic microscope. Rent time at your local university or college.

Voiding in Underfill process

Electronics Forum | Mon Jan 21 16:02:41 EST 2008 | rayjr1491

hi dave Is there another tool besides SAM (Scanning Acoustic Microscopy)? Regards, Ray

Agilent 5DX

Electronics Forum | Tue Jul 31 04:13:35 EDT 2001 | andyc

Thanks for the input Dave ... acoustic microsscopy sounds interesting - can you give me any leads on companies or info I can look up ? .

artistic performances with electronic clothes

Electronics Forum | Tue Dec 11 23:49:55 EST 2001 | caldon

WOW! Can't beleive I have input for this one. Try BOSE Corporation in USA. The Head quarters are located in MA and production is located in South Carolina. www.BOSE.com Best regards, acoustiCAL (Weak I know)

Looking For an Environmental Lab!

Electronics Forum | Thu Jul 14 16:38:13 EDT 2005 | sleech

Our present lab went "South." We need a lab that can do temperature/humidity conditioing, convection oven baking, C-Mode Scanning Acoustical Microscopic package inspection and "No-Pb" reflow simulation. We are evaluating a low temperature package dry

BGA rework

Electronics Forum | Fri Mar 30 14:47:27 EDT 2007 | GS

MSL 3) By SAM (Scanning Acoustic Microscope) before to remove them from PCB, you could identify if de-laminated or not and the degree of delamination. Best Regards...GS

Agilent 5DX

Electronics Forum | Mon Jul 30 21:10:32 EDT 2001 | davef

The 5DX weighs 8000 pounds. Can your product bear the overhead? We use acoustic microscopy to find BGA opens. We have not had good luck finding opens with other inspection technology. Has Agilent told you that you can detect BGA opens? How is th

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