Electronics Forum | Fri May 22 08:04:30 EDT 2009 | stevezeva
Have any of you ever worked with Actel's QFN 180? A three row I/O QFN? Actel has a published paper on design and assembly guidelines, but we're finding that they are pretty much generic, and don't really work as well as they lead you to believe. ht
Electronics Forum | Thu Apr 20 13:18:41 EDT 2000 | Ioan
Hi girls, try www.actel.com or, even better, bpmicrosystems.com. Good luck! Ioan
Electronics Forum | Fri Mar 16 17:09:30 EDT 2007 | davef
Actel, IBM, AMD, Xilinx, Aeroflex, maybe more ...
Electronics Forum | Tue May 26 15:39:16 EDT 2009 | mikesewell
Amkor's MLF guidelines are very similar to Actels. 1 to 1 on the stencil to part pad on the I/O pads, 75% with a grid windowpane, 0.125 mm/5 mil stencil. For example, the Actel area ratio for a 0.3 mm sq. pad and 0.125 mm stencil is 0.6 which seems
Electronics Forum | Thu Dec 18 21:09:06 EST 2008 | cadfamily
Welcome to http: //www cadfamily com supply EDA/CAM Learning Tutorial free download!!! For example:Mentor Graphic,Cadence,PowerPCB,PADS,ORCAD,AGILENG,ANSOFT,SYNOPSYS,ZUKEN,GENESIS,VA LOR,UCAM,PARCAM,VXWORKS,TONARDO,ACTEL,ACTIVE-HDL,FPGA ETC.
Electronics Forum | Mon Jul 28 14:30:22 EDT 2008 | grics
Take a look at this. Remember, these are only guidlines and can not replace any paste specs. As Real Chunks said, a profiler will be of HUGE help. We use this to determine what our top side temps are and to see if we have any problems with heat sen
Electronics Forum | Sat Jun 21 23:15:07 EDT 2008 | mika
Also keep in mind that the CCGA column length tolerance is at minimum +/- 0.13mm from most part manufactures and they don't collapse in the same way as a BGA, therefore the paste height deposit could be critical in some rare circumstances. Board warp
1 |