Electronics Forum | Mon May 21 18:24:42 EDT 2007 | kz9yyc
Hello, I am looking for any information regarding Assembleon's FCM Base II coordinate system. While some of my problems are due to inexperience and ignorance, I have read every manual, technical bulletin, and online message available to me, and I s
Electronics Forum | Mon Jul 23 12:31:03 EDT 2007 | gmoritz
Have you tried running it in step mode? Yes, and more. The installer asked me to run a few tests: 1> Intentionally make the machine miss insert a part then put a part in manually to see how the leads align to the cutter head. 2> Push the re
Electronics Forum | Sat Aug 11 05:29:31 EDT 2007 | johnz
We are having a problem with JST connector ICM-MA50H-SS52-1161 LF SN. After reflow oven soldering we have mostly problem with soldering quality for firs or last leg of the connector. (There is no connection- leg just lays-lift on the solder no wicki
Electronics Forum | Tue Mar 24 09:04:33 EDT 2009 | sachu_70
External CO2 extinguishers certainly help. But requires the alertness of a trained personnel to use the same effectively during a fire. I have also come across a solution wherein the extinguisher is kept always connected to continuously deliver pres
Electronics Forum | Tue Apr 28 08:51:35 EDT 2009 | davef
This is a snip from an ealier post here on SMTnet. Generally, solder pastes are comprised of: 90% solder powder, 5% flux, 4% solvents, and 1% activators [by weight]. Where: * Solder powder, when reflowed, is a metal bonding agent that mechanically
Electronics Forum | Fri May 22 15:37:23 EDT 2009 | 1smtdude
Depending on the material chosen, it's possible to �rework� underfilled components. However, it's far from a production process. Two steps are usually required. First: remove the package from the PCB. Second: remove the residual underfill from the P
Electronics Forum | Thu Mar 11 02:56:01 EST 2010 | grahamcooper22
Hi, blow holes / pin holes / holes in joints are usually a sign that there is excess moisture somewhere around the solder joint. Moisture can be in pcbs / components, so try drying them....a simple thing to do is pass a bare pcb throught your reflow
Electronics Forum | Mon May 17 13:34:22 EDT 2010 | davef
If it's not adhesive, try an ESD-type ionizer. The objective of an ionizer is to eliminate surface charge on insulators and on isolated/ungrounded conductors. Practically speaking, the action of an ionizer is to drive the voltage on the surface of a
Electronics Forum | Thu Sep 22 14:54:01 EDT 2011 | hegemon
You might find a lot of experience in the forum here, but maybe not so many consultants for this niche. BGA underfill is not rocket science, and in my opinion, the key items are the material chracteristics, and the dispensing method and pattern. Fo
Electronics Forum | Tue Apr 10 04:16:20 EDT 2012 | grahamcooper22
you are seeing a typical issue that is caused when such small volumes of paste are printed....there are several reasons for it..the tiny amount of flux in the small deposit becomes exhausted much quicker then it does in a larger deposit ( the flux ma
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