Electronics Forum | Wed Jun 24 13:46:41 EDT 1998 | Chris Kelly
Brian, a couple of things really stick out here... 1) You are spraying what is referred to here at the CATT as "PINK DEATH" The 3355-11 is about the most active/aggressive flux you can get your hands on. I am concerned about both the condition
Electronics Forum | Wed Jul 27 11:28:55 EDT 2005 | jh0n!
This may be completely normal, but I'm not used to seeing this with our old SnPb. I'm setting up reflow profiles for a SAC305 alloy, and it seems that on some of our larger pads, the flux seems to pool in the center. Is this perhaps a sign that I'm
Electronics Forum | Thu Jan 11 00:17:08 EST 2007 | behrsam
Thanks both of you for responding. I am using a protoype reflow oven. It uses a programable controller to ramp the temp up. It has convection and radiative heating. Ultimately yes, I would like to use a vacuum furnace like the sst but it is not c
Electronics Forum | Thu Jan 11 22:15:27 EST 2007 | behrsam
it's a vacuum dewar so adhesives will eventually permeate and the vacuum would be lost. Sounds to me since I have the N2 capability, I definately should try it. I am obtaining Indium Flux and Solvent so I can adjust the activity when I start using
Electronics Forum | Sun May 19 06:43:37 EDT 2002 | xzinxzin
I using water-soluble solder paste, the solder paste recommended, the peak temperature is 215 deg C, the dwell time above 183 deg C is 60-90 sec. **How I can do, the flux in solder paste is active enough to remove the corrosion on the Cu leads to get
Electronics Forum | Fri Jun 15 08:47:18 EDT 2007 | ed_faranda
I by all means, am not an expert on Wave processes. But, our second bottom side zone for our wave is down. My boss said "well the flux looks okay, just run it" and won't give me the machine to properly fix. How many people have a problem with thi
Electronics Forum | Tue Mar 10 22:16:56 EST 1998 | Steve Gregory
Jeremy, I'm gonna make a couple of assumptions by "reading in between the lines" of your email: 1. You're using no-clean paste. 2. This is only happening on the second side. You tell me if I'm wrong about this... First thing, if you're only experienc
Electronics Forum | Mon Jun 19 16:59:07 EDT 2000 | D.A.Munro
We use both Nc and Ws at wave and reflow, Nc is less forgiving and the board topside must reach aprox.110c prior to wave to be fully activated. Your application of the flux is even more criticale,it's not very agresive for one thing and apply to much
Electronics Forum | Mon Feb 01 16:40:45 EST 1999 | Dave Waddick
I have a product using high temperature solder to connect terminal pins to a PCB. The board is single sided copper, no plaiting. The solder is 95% tin 5 % silver. The flux is low activity rosin. The product is a subassembly. When the product is
Electronics Forum | Wed May 15 19:55:19 EDT 2002 | russ
Good point, I am preheating for 90 sec to a temp of 170 C. (PCBA) then reflowing for 40 sec. to bring it to 215 C. I will try a softer hammer. This has been working on other assemblies with the same package however. Do you know if a water soluble
