Electronics Forum: adding (Page 81 of 125)

Dealing with TH Barrels on Bds w/Heavy Ground Planes

Electronics Forum | Thu Oct 16 11:15:53 EDT 2008 | davef

A good solder connection with heavy ground plane requires: * Plenty of heat [Is the preheater located too far from the wave? Whenever you look at board temperature, there is a sharp decrease in temperature between the preheater and the wave.] * Conta

Bottom side adheasive

Electronics Forum | Thu Dec 11 04:25:06 EST 2008 | lconnor

I have previously experienced dispensing glue dots using a camalot system. This was used to dispense dots for a variety of components, as the SMT was applied post through hole and then wave soldered. No paste was used in the process. The other benefi

Graphite/Carbon deposit on PWB ( any Industrial Specs?)

Electronics Forum | Fri Mar 13 11:55:23 EDT 2009 | boardhouse

Hi GSX, just and FYI on why you are seeing a difference per lots. Carbon Ink is Not used on a steady bases by most manufactures, and shelf life of the Carbon ink is fairly short, my guess is what they are doing is adding thinner to the carbon ink t

New Fuji NXT

Electronics Forum | Tue Apr 14 11:43:30 EDT 2009 | rmitchell

Hi, We are considering adding on to our SMT line. Our current line is CP65, IP3 and we would like better placement on our 0402's and 0201's. We were looking at the NXT, we would need larger pcb table to match our other machines. We probably only nee

Misalignment Brainstorm - Fiducials On Board VS On Breakaway Tab

Electronics Forum | Fri May 08 16:57:13 EDT 2009 | rmitchell

Hi, I have had similar issues. First as the above replies suggest pcb fids are better than panel scrap fids, even if you have to use fids under QFP's just palce those parts last. If your machine has board skip. Place 1-2 QFP's on pcb # 1 and check

Water Washing

Electronics Forum | Mon Jan 04 21:32:40 EST 2010 | boardhouse

Conductive Anodonic Filament My worry is that any extra moisture added to the Lead free Material during assembly may cause this Conductive filament to grow within the material weave. They are water washing after through hole assembly and then after

AOI usage

Electronics Forum | Wed Mar 10 08:31:22 EST 2010 | sibbe

Currently I'm working on a study of the quality of our SMD process. For this I am investigating the possibility of adding an of-line AOI There has been previous research done (late 2007), bij the company I work for. Since there could have changed

Need used pick and place for low volume, high mix - suggestions?

Electronics Forum | Thu Apr 29 09:18:54 EDT 2010 | rgduval

If you go with a Quad from PPM, I believe that they've developed a windows interface for the machine. They also have a couple of old Quad people working there for continued support. --I receive no benedits from PPM, but I am a happy customer-- We

Wave soldering of PTH components with pitch 1.27mm

Electronics Forum | Thu Jul 08 09:29:10 EDT 2010 | mb_mfg

There are several things that can be done. Shortening the lead length should eliminate bridging between lead. We had done a project several years ago where the customer had shortened the leads to almost flush to the board, preventing any chance of

Selective Soldering - Barrel Fill

Electronics Forum | Fri Oct 22 19:34:56 EDT 2010 | hegemon

Thanks for the help guys. Nice to think I was basically on the right path. PCB manufacturer has finally conceded the barrel defects and is remaking the PCBs. We are big on pre-tinning the leads of TH connectors as well as providing some good pre


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