Electronics Forum: adding (Page 91 of 125)

Re: solder joint problem?

Electronics Forum | Wed Jun 14 08:08:56 EDT 2000 | Wolfgang Busko

Hi ji tae, we had a similar problem with QFPs 0,5 pitch processed by one subcontractor. The symptoms we noticed were: - the solderjointshape and wetting looked normal - the surface had a dull gray appearance - by pushing a lead sideways with a tweez

Re: IP3 QFP Problems - Has anybody had the same probs?

Electronics Forum | Mon Jun 05 22:40:40 EDT 2000 | Dean

...well, if I had Fuji in on 4 occasions and the problem is not resolved I would wonder what exactly I paid for... Here is what I would do. 1. Run the glass plate program. This will eliminate variables in your production parts and boards. Additi

Researching stencil cleaners

Electronics Forum | Wed Mar 28 20:03:33 EST 2001 | Rob Fischer

This is brutal. I think we should call a truce. Mike has very good points and his quotations from the EPA letter are fact. If there isn't a competitor of Bill's who hasn't seen this letter I'd be surprised. We could go on and on about this and th

RMA flux Based Solder Paste

Electronics Forum | Thu Apr 05 12:25:01 EDT 2001 | davef

Talk about bucking the trend!!! OK, OK, I know some US military work still requires RMA. You�re both correct. Cleaning decisions for RMA fluxed boards are based on customers requirements. [Some do (clean) and some don�t.] Older US military speci

Wet behind the ears

Electronics Forum | Mon Apr 30 10:06:13 EDT 2001 | CAL

John- Just few ideas at random (brainstorming) - While times are slow invest in training of your current staff. There are some great training facilities out there offering valuable knowledge. Knowledge is a valuable thing to have and will prove to be

Re: 2nd reflow

Electronics Forum | Thu Oct 26 17:48:12 EDT 2000 | ptvianc

Hi: Generlly speaking, in a reactive mode, nitrogen blankets are used to improve the yield of a process that is marginal in terms of removing, and/or preventing the re-appearence of, oxides on copper features or component I/Os. That marginality can

IPC-7912 DPMO

Electronics Forum | Tue May 08 19:28:29 EDT 2001 | mparker

Received my copy of the standard about a month ago. Seems straightforward and gets away from the percentage nightmare. Mark Twain said it best with "There are 3 kinds of lies in this world - lies, damn lies and statistics!!" Now I have some nagging

Leadless Leadframe Part Manufacture Issues

Electronics Forum | Tue May 22 17:24:12 EDT 2001 | davef

What is your thinking on the issues surrounding design and manufacture with leadless leadframe [eg, land grid array, micropak] components beyond those in http://www.national.com/ads-cgi/viewer.pl/an/AN/AN-1187.pdf? The curve ball that we just looked

Test vehicle for PWA cleaning

Electronics Forum | Tue Jun 26 19:48:29 EDT 2001 | davef

Information a SIR test vehicle can be found in IPC-9201, SIR Handbook [http://www.ipc.org]. Common test boards are: * IPC-B-24 (copper and HASL, FR-4 and polyimide) * IPC-B-36 (bare copper and HASL, FR-4 and polyimide) * IPC Phoenix board (bare copp

Manual Stencil Alignment

Electronics Forum | Wed Jun 27 21:24:47 EDT 2001 | davef

Welcome. First, proper alignment can produce an order-of-magnitude increase in the number of boards that can be printed without wiping. The initial alignment can be made either by: * Peering through the stencil apertures at the board underneath and


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