Electronics Forum | Sat Mar 14 08:28:28 EST 1998 | Rudy
| I would like to hear from anyone producing high mix (~200 modules) with low volumes (5-2000 per year) using an automatic line running lot sizes in the 5-50 range. We are engaged in an investigation to invest in this capability. A view into the or
Electronics Forum | Thu Aug 23 15:45:48 EDT 2001 | slthomas
So, we've already addressed the tombstoning on these guys by adopting the mfr's (Pana.) recommendations for pad size and spacing. Problem is, we have pretty bad wetting of some of these parts. The rest of the board we use them on looks great, nice
Electronics Forum | Tue Sep 18 15:35:23 EDT 2001 | jschake
A laser cut stainless steel stencil was used exclusively for the evaluation of the complete 0201 assembly process, which addressed printing, placement, and reflow. However, I have also conducted off-line 0201 print tests using a nickel electroformed
Electronics Forum | Thu Sep 27 16:11:38 EDT 2001 | flipchip
Monkey, I have read all the replies you received. I have extensive experience in reworking these parts. There are several ways to approach your problem. If the chips are bumped you will need to have a stencil to apply the flux. If the chips are u
Electronics Forum | Tue Dec 11 19:41:28 EST 2001 | lsjp
Hi there, I am a bit late in answering the question about removing (and probably replacing) those d&%&$Z3 Mictors. Are they straddle mount or vertical? How many segments? What's the configuration of the board (PCB thickness, adjacent components, part
Electronics Forum | Wed Jan 30 08:30:33 EST 2002 | seto
Hello Dave, Mechanically the conection between the component pad and PCB pad is good (the solder joint is very strong). The problem is associated with poor contact after the use by the customer (vibration, temperature, etc). You can see the pictures
Electronics Forum | Wed Mar 20 13:49:15 EST 2002 | cabjerk
Hi All; The following is from our Support people who worked with Fuji on the problem; Last week Luke Mittur and John Gudel were in from Fuji to address the IP3 issue outlined below. The problem ended up being that the table "up" and table "dow
Electronics Forum | Tue Apr 09 10:36:32 EDT 2002 | gregp
I assume there are a variety of people that participate in this forum, i.e. contract manufacturers, OEM's, in a variety of job functions related to the production of surface mount boards. I have read about many concerns regarding the wrong part issu
Electronics Forum | Tue Aug 13 13:17:39 EDT 2002 | peterson
We are having trouble with some through-hole connectors "shorting out" on a thick backplane. Preliminary research is suggesting that it may be due to excess flux, trapped under the plastic connector shell. I have done a bit of searching in the fine S
Electronics Forum | Mon Sep 23 08:42:25 EDT 2002 | bdoyle
I have performed many insourcing vs. outsourcing analyses. The following are the key issues that are normally evaluated: Cycle time requirements for product development and manufacturing Cost of manufacturing (in-house vs. subcontracted) Inve
