Electronics Forum | Thu Aug 07 11:58:36 EDT 2008 | pbarton
We have experienced the same problem with Pd/AG and P/Ag terminations on precision resistive parts. The problem is dissolution of the termination metallisation into the bulk solder. This is exacerbated by the higher thermal profiles required for RoHS
Electronics Forum | Sun Dec 28 15:19:49 EST 2008 | davef
A long time ago, Phil Zarrow wrote �Evaluating solder paste - not an option� to give tools for evaluating various solder paste properties. You are interested in �post placement tack.� Find Phil's paper at: * His site http://www.itmconsulting.org *
Electronics Forum | Tue Feb 24 18:33:59 EST 2009 | gregoryyork
It is probably due to the solder mask being undercured and is porous alowing the flux to be absorbed which boils when it hits the solder wave that kills the adhesion. You should be seeing this only over copper traces/tracks. Reduce flux volume and in
Electronics Forum | Tue Apr 07 15:36:15 EDT 2009 | gtemkin
Most of the conformal coating manufacturers recommend verifying the compatibility of their coating with the solder mask, so it's no surprise that occassionally there will be such issues. Are you sure your conformal coat is completely cured? If your
Electronics Forum | Fri Mar 19 10:02:44 EDT 2010 | karlo
There is a wide range of BGA underfills to satisfy specific needs. Some are designed for those who place a premium on high speed, high volume processing, shock or drop test perforamnce, and ease of reworkability. Others are designed for those who p
Electronics Forum | Sat Jun 06 15:11:17 EDT 2009 | ysutariya
Was this a lead-free capable material that fits into IPC 4101/126 or /129, like an Isola 370HR? I would not be surprised because from the picture I think I can see resin underneath the lifted copper, which is an interlaminate separate. This is a
Electronics Forum | Sat Jun 27 10:10:23 EDT 2009 | ysutariya
I'm not in assembly, but I do know of a technology called Sipad if you are only looking to do small batches. They pre-apply the solderpaste to boards with a light adhesive, which allows you to hand-place components, even micro BGA's and fine-pitch Q
Electronics Forum | Thu Sep 24 08:27:34 EDT 2009 | scottp
We're in the high reliability market and build to IPC Class 3 standards. I honestly don't know much about ESD but our in-house expert measured an 8kV charge on the board after printing with a plastic stencil and rubber squeegees. He wasn't too plea
Electronics Forum | Mon Sep 14 14:16:35 EDT 2009 | operator
I am looking for alternative, low cost materials to build ESD Safe Totes from. Standard totes really do not fit our products well. I would like to create custom, shielded totes with dissipative surfaces inside. Whether it is an ahesive film or paint
Electronics Forum | Thu Oct 08 11:33:16 EDT 2009 | cab
We are currently wirebonding MCMs with surface components located in very close proximity to wirebond pads, which are gold plated. We are ball bonding with 99.99% Au wire. Normally we do not have problems, however if product has been reflowed seve
