Electronics Forum | Thu Nov 19 16:24:23 EST 1998 | Earl Moon
| Hello Everybody | | I am new to the electronics packaging arena, please be patient with me... I have a few questions regarding the various passivation used on the silicon dice. I would really appreciate if you guys could provide me with more info
Electronics Forum | Fri Oct 23 04:16:16 EDT 1998 | Tony B
| | My company is looking for higher density for card layout. One suggestion has been locating active components packaged in SOT's and SOIC's on the B-side of the card. This in turn will require wave soldering of the above mentioned components. When
Electronics Forum | Thu Sep 10 17:38:30 EDT 1998 | Dave F
| I was wanting to know if double sided reflow can be done with a metal plated BGA on topside. We would be running bottom side first. My boss seems to think the only way it can be done is by placing glue dots on the bottomside compoents because the
Electronics Forum | Sat Jul 25 00:09:13 EDT 1998 | Phillip Hunter
Use caution if epoxy is dispensed under the PLCC 84. If the "SMT Gods" look unfavorably onto you rework will be difficult. I had a ceramic PLCC 84 which weighed 15 grams (MCM) and due to packaging failures (glass seal to metal cover) rework was the
Electronics Forum | Fri May 22 16:08:05 EDT 1998 | Steve Gregory
Hi ya' Mike! For low temperature baking, IPC-SM-786A (Procedures for Characterizing and Handling of Moisture/Reflow Sensitive IC's) specifies a low temperature bake that can be done in the component shipping packaging...ya' wanna remove the bubb
Electronics Forum | Tue Apr 28 23:48:20 EDT 1998 | Jojo
| I'd like to find a buyer for the following used equipment: | Make: Universal Instruments | Model: 4713D Adhesive Dispenser | Options: Rotatable dual-dot head (0deg, 90deg) | Price: Asking $4K (No reasonable offer refused) | I should note
Electronics Forum | Sun Apr 05 09:46:47 EDT 1998 | Earl Moon
| We are looking at reflow soldering some Flexi-rigid | pcbs. I have heard that IR reflow soldering can make the Polyimide "self heat" and cause de-lamination. | Does anyone have any info. The thermal problems associated with polyimide rigid/flex de
Electronics Forum | Thu Aug 23 20:51:15 EDT 2001 | davef
Every thing you need is in "links" here http://packaging.hp.com/. The only thing you need to do now is find it. Ah, so much information, so little time. Yeh yeh yeh, nice little ESD bags are good. Er, maybe sealed barrier bags might be better. E
Electronics Forum | Wed Sep 11 07:37:11 EDT 2002 | mk
Whoaaaa Genny, Its not that bad!!! The difficulty factor is in assembling your own boards is all releative to how many, and how difficult they are. Most studies show that the vast majority of defects in smd assembly are generated in the application
Electronics Forum | Mon Mar 03 19:50:25 EST 2003 | ruggi
Hi, We dealt with and solved this problem here at Agilent...We have been doing simultaneous reflow cure in convection reflow ovens for all of the 9 years I've been here with minor problems of chips falling off, and after switching to Loctite 3609 th