Electronics Forum | Fri Feb 11 08:15:35 EST 2005 | davef
It sounds like you already know the answer. Hand soldering is much more stressful to a board than mass soldering, because: * It is more localized and there is no preheat. * It is more difficult to control. [Different connections require different h
Electronics Forum | Wed Jun 01 09:39:15 EDT 2005 | George Truitt
Circuitcam and Checkpoint = �YOU GET WHAT YOU PAY FOR� It was 1 hour from the time I received the software until the time I was using it. I compared 2 Bill of materials (1200 placements topside 274 bottom side) due to rev changes, created a visual a
Electronics Forum | Wed Feb 01 08:12:04 EST 2006 | Chunks
OK, this is easy. You say HIGH fall out, so I can assume 25 or 50%? If so, run 10 without the heat gun and 10 with. This should show you if the heat gun process is the cause or not. If the relay is a surface mount, hand solder them on. If it's a
Electronics Forum | Fri Mar 17 16:58:52 EST 2006 | mikecollier
We are currently struggling with a particularly difficult component selection form our designers. This is a custom BGA, 592 balls, metal cover with a very large bead of adhesive using to retain the cover. We have had significant fallout (greater th
Electronics Forum | Sun May 21 09:38:25 EDT 2006 | davef
Epoxy Removal and IC Delidding [Hardware Hacking: Have Fun While Voiding Your Warranty, Chapter 14] Encapsulation of critical components using epoxy or other adhesives is commonly done to prevent tampering and device access (the microprocessor shown
Electronics Forum | Thu Sep 14 13:13:29 EDT 2006 | Kevin W. Parker
I am a tool and process engineer responsible for the cleaning system at Siemens VDO in Huntsville, AL. I have been over this area for more than 8 years. We use EMC Cyberclean 3000RF spray in air cleaners with Zestron SC202 chemistry. At this facil
Electronics Forum | Wed Oct 04 09:55:51 EDT 2006 | borgie
Hi. I have product in lead containing process that consist lead free BGAs and also big ceramic BGAs with high temperature bumbs. Pcb tends to bow in a reflow profile, since I need long preheating times and relatively high peak temperature to melt BG
Electronics Forum | Thu Dec 07 19:54:55 EST 2006 | davef
We agree with "guest" above. This a "chip bonder" type material used to improve the reliability of array type devices. "A relative comparison of the N50 values is given below: No underfill = 1.0X (baseline) Corner bond = 1.3X Non reworkable underfi
Electronics Forum | Fri Dec 29 08:14:19 EST 2006 | joey_dragon
Thank you for the quick reply! Actually, the "type B" I referred to applies to a flex cable that can be found in this page: http://www.tennrich.com/trtw/cabling_3.php It is a reverse Engineering project and, from what I can see, there is, indeed,
Electronics Forum | Wed Feb 07 13:44:09 EST 2007 | dsoohoo
After some precursory experimentation, I am planing on employing a form of low melting temp solder for use in reworking some very dense, copper core PCB's, both SMT and THT, which were originally mounted with 63/37 solder. The main problem with the
