Electronics Forum | Thu Feb 05 08:08:46 EST 2004 | stefwitt
To my point of view, you should be aware of some issues. Manual taping machines with a foot switch for tape advancement require quite a few adjustments before you start the job, like: Tape width adjustment, component rail adjustment, pitch setting,
Electronics Forum | Mon Jan 24 18:41:43 EST 2005 | Chunks
Sorry Pete (and others), they do have em'. Back side of the oven. Open the doors with the power supply switch and it's right next to the power relay. Little digital ones on the Omni Flo series. Nope, our company is selling the ovens and several i
Electronics Forum | Fri Feb 11 08:15:35 EST 2005 | davef
It sounds like you already know the answer. Hand soldering is much more stressful to a board than mass soldering, because: * It is more localized and there is no preheat. * It is more difficult to control. [Different connections require different h
Electronics Forum | Wed Jun 01 09:39:15 EDT 2005 | George Truitt
Circuitcam and Checkpoint = �YOU GET WHAT YOU PAY FOR� It was 1 hour from the time I received the software until the time I was using it. I compared 2 Bill of materials (1200 placements topside 274 bottom side) due to rev changes, created a visual a
Electronics Forum | Wed Feb 01 08:12:04 EST 2006 | Chunks
OK, this is easy. You say HIGH fall out, so I can assume 25 or 50%? If so, run 10 without the heat gun and 10 with. This should show you if the heat gun process is the cause or not. If the relay is a surface mount, hand solder them on. If it's a
Electronics Forum | Fri Mar 17 16:58:52 EST 2006 | mikecollier
We are currently struggling with a particularly difficult component selection form our designers. This is a custom BGA, 592 balls, metal cover with a very large bead of adhesive using to retain the cover. We have had significant fallout (greater th
Electronics Forum | Sun May 21 09:38:25 EDT 2006 | davef
Epoxy Removal and IC Delidding [Hardware Hacking: Have Fun While Voiding Your Warranty, Chapter 14] Encapsulation of critical components using epoxy or other adhesives is commonly done to prevent tampering and device access (the microprocessor shown
Electronics Forum | Thu Sep 14 13:13:29 EDT 2006 | Kevin W. Parker
I am a tool and process engineer responsible for the cleaning system at Siemens VDO in Huntsville, AL. I have been over this area for more than 8 years. We use EMC Cyberclean 3000RF spray in air cleaners with Zestron SC202 chemistry. At this facil
Electronics Forum | Wed Oct 04 09:55:51 EDT 2006 | borgie
Hi. I have product in lead containing process that consist lead free BGAs and also big ceramic BGAs with high temperature bumbs. Pcb tends to bow in a reflow profile, since I need long preheating times and relatively high peak temperature to melt BG
Electronics Forum | Thu Dec 07 19:54:55 EST 2006 | davef
We agree with "guest" above. This a "chip bonder" type material used to improve the reliability of array type devices. "A relative comparison of the N50 values is given below: No underfill = 1.0X (baseline) Corner bond = 1.3X Non reworkable underfi
