Electronics Forum | Tue Sep 22 23:43:46 EDT 2009 | rohitfast
Hi Stephen, Can you pl suggest what exactly needed for the process? There is no any standard method to ensure for the ESD damage. ESDS:2020 is talking about only for persoanl and equipement grounding mechanism, in the process no insulator should be
Electronics Forum | Tue Nov 03 09:32:57 EST 2009 | valeo
Hi all, I'm today looking for adhesive specifications on SMT process (by printing). The Glue printing process is new in my company, and I need info, please!!! Do you know specifications about Shear component value with gluing process (on component
Electronics Forum | Thu Nov 12 12:05:06 EST 2009 | valeo
Up! Thanks anyway for your answer Lynn. But I'm still in the issue regarding the assembly of passive components on substrat with conductive adhesive. We hardly reach the minimum specifications of shear strengh for each component we use (1206, 0805
Electronics Forum | Thu Dec 17 03:55:41 EST 2009 | tod1967
Inspect your dispensed or printed adhesive deposits 100%, make sure your Pnp gives 100% 1st time placement and your cure is adequate. Conveyor or manual brd transfer can also be an issue. usually is in the process. Hopefully your following Loctite
Electronics Forum | Thu Feb 25 10:21:49 EST 2010 | jdumont
My guess would be that the adhesive used on the dots contains silicone. We use 1B73 which is also acrylic and it hates silicone. We use silicone RTV to permanently mask around some connectors and unless its fully cured before coating it will cause l
Electronics Forum | Wed Apr 28 12:08:02 EDT 2010 | tjg
Our latest designs are flip chip on flex based and we have issues with delamination/blistering. We know it is related to our vapor solvent (n-Propyl Bromide based) attacking an inner layer adhesive. Has anyone else ever heard of something like this?
Electronics Forum | Mon May 17 12:46:43 EDT 2010 | flipit
Big problem. Certain LED from certain manufacturer sticks to the tape and reel cover tape. Peel back the cover tape and every LED lifts out of the embossed pocket and sticks to the cover tape. I believe this is from static and not any sort of adhe
Electronics Forum | Tue May 25 11:37:50 EDT 2010 | davef
Where on the assembly is the dewetting occurring? Factors that influence dewetting usually involve non-ionic contamination such as: * Residues from board manufacture including silicone surfactants from solder resist & HASL rinse contamination * Comp
Electronics Forum | Mon Aug 09 08:16:44 EDT 2010 | markhoch
It will most likely hold on. There is a formula that you can use if you're uncertain. It's (weight of the component in grams)/(total pad mating area in square inches) Grams per square inch must be less than or equal to 35 for the component to be mo
Electronics Forum | Mon Dec 27 10:03:35 EST 2010 | duso02
Contact your distributor for the coating or Humiseal directly. Humiseal has had a recent issue with batches of 1B31. The specific problem is lack of adhesion, which is what you have as well. You need to find out if your batch # is one of the affected
