Electronics Forum: adhesive+ (Page 121 of 144)

Conformal Coating Equipment

Electronics Forum | Wed Feb 20 10:12:27 EST 2013 | dontfeedphils

Hey Bill, it really depends on the material you're looking at using UR, SR, AR, the easiest to deal with being AR, although if you can find a UR that doesn't clog up the machine too bad those are usually more viscous and easier to apply selectively u

BGA Reballing Micro Devices

Electronics Forum | Mon Apr 29 14:36:26 EDT 2013 | bandjwet

I am trying to determine who out there is reballing devices below 0.4mm in pitch. We have been reballing as small as a 4-balled 0.15mm 4 mil ball diameter area array devices using an adhesive-backed reballing preform. 1. For such small devices we h

Effects of Silicone on Ionic Contamination Testing

Electronics Forum | Thu Oct 17 17:29:46 EDT 2013 | lordofpiggies

Hello. We are building a CCA which has a silicone-based adhesive whose purpose is to bond the bottoms of multiple LED displays to heat sinks. Our customer wants the CCA to be tested for ionic residues per J-STD-001, but we are hesitant to test the

Effects of Silicone on Ionic Contamination Testing

Electronics Forum | Tue Oct 22 16:30:50 EDT 2013 | joeherz

Dear Lord, We have had similar challenges with customer requirements related to ionic testing. You have determined that you cannot get a reliable result from testing at the stage where the adhesive has been applied. That option is out. Assuming

IRC/TTE MELF resistor failures

Electronics Forum | Wed Mar 30 14:02:25 EDT 2016 | blnorman

The program I'm working on is having endcap metallization/resistive element failures. These are on MELFs manufactured by IRC/TTE (MCHP). A sister program is having the same issues. They pulled a couple of date codes and did visual examination and

Golden Finger contamination with Solder after reflow

Electronics Forum | Tue Nov 14 08:52:07 EST 2017 | davef

If you think the problem is occurring in the box and it is wide spread, consider replacing your solder paste with your paste supplier. There are paste formulations aimed at the solder balling issue that some LF pastes create. On tuning your reflow r

Component ( Connector ) drop during secondary reflow

Electronics Forum | Mon Dec 03 15:03:49 EST 2018 | dleeper

I can't open your spread sheet to see how you calculate this, but usually this sort of calculation assumes the leads are spaced symmetrically on both sides of the part and the center of mass is between them. Gravity pulls the part down, while the wet

conformal coating over inspection stamps

Electronics Forum | Thu Jun 27 08:47:21 EDT 2019 | SMTA-John

Having success with Circuit Boards #432 Solvent Resistant Ink - Designed specifically for circuit boards. This medium dry ink is highly resistant to solvents .... It is also non-conducting. Note: this ink contains an aggressive solvent so should not

Searching for a tape to seal the end of smd role after using

Electronics Forum | Mon Dec 21 15:00:51 EST 2020 | spoiltforchoice

Specific to this very purpose https://www.somersetsolders.com/smt-reel-sealers/p319?gclid=CjwKCAiArIH_BRB2EiwALfbH1AeOU9NaGStQBhvTITVHLZW0UtXMDFfbdo4YB4vtIyP9DxTGYWGAGhoCXLIQAvD_BwE Nothing Steier is cheap, while its easy enough to find cheap altern

SMT Reel Tape

Electronics Forum | Mon Jun 19 13:55:00 EDT 2023 | spoiltforchoice

Pressure sensitive adhesive cover tape https://www.digikey.co.uk/en/products/detail/3m/2668-5.4MMX500M/16685639?utm_adgroup=&utm_source=google&utm_medium=cpc&utm_campaign=PMax%20Shopping_Product_New%20Customer%20Acquisition&utm_term=&productid=16685


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