Electronics Forum: adhesive+ (Page 36 of 144)

Adhesive Spray for testing and trim P&P

Electronics Forum | Mon May 14 10:57:08 EDT 2018 | Robl

Hi Ivan, We use a strong double sided tape/sheet. I would be concerned with an adhesive as it would still be curing going through the machines, gassing out vapor. The double sided works OK with our 0201 test board - 16000 placements in rows at 0,9

Thermal Conductive Adhesive Sheets (AUTO PLACEMENT PROCESS)

Electronics Forum | Fri Dec 07 07:23:58 EST 2018 | vinzon02

Hi Thus anybody here have experience on Thermal Conductive Adhesive Sheets? We have one IC component that need to be place with this material to fill in the gap between the pcb and space on its body. Currently we are performing this manually by, a

Re: Screen Printing Glue

Electronics Forum | Wed Mar 31 14:30:11 EST 1999 | Dave F

| We have carried out some experimental work, in conjunction with DEK. Instead of dispensing adhesive for SMD components onto the bottom side of on of our PCBs, we have looked at the possibility of screen printing the adhesive. Because, at the stage

Re: Conductive adhesive

Electronics Forum | Sat Aug 22 16:07:31 EDT 1998 | Manuel Cornejo

| | Require a conductive adhesive - either isotropic or anisotrpic - which can be used for 100micron oitch devices. | | Must be resistant to solvents such as MEK and acetone. | | Cure below 150C, with possible potential for rework of the conections.

Microscreen stencils

Electronics Forum | Tue Nov 29 12:53:56 EST 2005 | bschreiber

Hello Billy, You are correct when you say that you may want to look at the detergent (chemistry) you're adding to the stencil wash. However, "geared for epoxy removal" depends on how the chemistry is designed to remove the epoxy. If it is a "water

defects in pcb manufacturing

Electronics Forum | Tue Nov 03 20:00:47 EST 2009 | davef

Solder Mask Adhesion Pull Test Tape List IPC-TM-650 Test Method 2.4.28.1, Adhesion, Solder Resist (Mask), Tape Test Method, defines the procedure for determining the adhesion of solder resists (masks) used over melting metals, (such as solder plated

Metal foil is pulling away from the screen.

Electronics Forum | Mon Feb 19 13:04:17 EST 2001 | billschreiber

The ultrasonic frequency used in today�s stencil cleaners is usually a 40 kHz �sweep� frequency (also used on semiconductors and other sensitive cleaning applications). This frequency is not low enough to cause stencil damage (the lower the frequen

Glue Dispense Process Control

Electronics Forum | Fri Aug 10 13:52:58 EDT 2001 | davef

When you say that glue viscosity changes for lot to lot, is this LOT TO LOT of your product OR Loctite�s product? And when you say that glue viscosity changes, what do you mean [eg, increase by � , decrease by � , er watt?]. What specifically is th

DEK pro-flow

Electronics Forum | Fri Feb 16 09:30:38 EST 2007 | DEK Answer Guy

Hello PR, PumpPrint� technologies enable high throughput adhesive deposition using a screen printing platform. Careful selection of stencil material, and informed study of the design of apertures and other stencil features, enables a wide range of

Bottom side process question

Electronics Forum | Wed Mar 14 18:17:40 EST 2001 | mparker

Some thing to watch out for is the cure spec for the adhesive. Will that match with your solder paste reflow spec? You will have two dissimiliar materials going through endothermic reactions at the same time. You could end up with under cured adhesiv


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