Electronics Forum | Thu Feb 22 12:26:33 EST 2001 | traviss
I used a Blue M batch oven quite a bit to cure in works great. All you have to do is get the board up to cure temperature, 150C normally and your all set. It will probably be in there longer than the time required but at that low temperature it shoul
Electronics Forum | Tue Mar 13 18:25:45 EST 2001 | slthomas
Anyone doing a print-dispense-place-reflow process? I've never heard of it being done this way before today. Don't know why, actually, as it sounds like a fairly friendly method provided the adhesives used are happy with a standard reflow profile.
Electronics Forum | Wed Mar 28 00:20:48 EST 2001 | chinaren
we use the screen glue AMICON D125 F5 from Emerson company of Belgium and stencil is Varidot stencil from Loctite with thickness of 250 micrometers The squeegee is also from loctite, previously we use squeegee of material PU, it is easy to be broke
Electronics Forum | Mon Apr 02 20:47:22 EDT 2001 | davef
Cuppla questions for ya ... Where are the shorts [above the mask or between the mask and the laminate]? On the board, what material is between the copper traces and the mask? What type of solder mask(s) used by your suppliers? What are they using
Electronics Forum | Fri Apr 13 22:38:19 EDT 2001 | edylc
Hi , Could you be seeing the nickel under the gold plating because you are removing some of the Gold with the Kapton Tape....?? You mean , the adhesive properties of the kapton tape will cause the gold plating on the gold finger to be somehow peel of
Electronics Forum | Thu Jul 20 16:23:08 EDT 2000 | Bob Willis
We set up and ran this process at Nepcon UK with some success but we used a UV adhesive less than 10sec cure so no heat. Push off force for the biggest parts was over 800 grams. We have had to modify the design rules a little to make it work but it
Electronics Forum | Tue May 15 09:01:41 EDT 2001 | davef
Stephan makes good points. While monitoring the temperature in the plant is good, it might be more appropriate to measure the temperature in the cabinet of your dispensor. A sure indicator of temperature change is process changes over time. Consid
Electronics Forum | Mon Jun 18 22:04:01 EDT 2001 | davef
YA DON NEDA YELL!!! AHYAINT DAFF YANO!!! Printing adhesive near fine pitch devices can risky. Be careful. Look here to get started: http://www.alphametals.com/products/techarticles/soldrpstncl/guidelines.html [I know this link is expired, but may
Electronics Forum | Sun Jul 15 17:48:51 EDT 2001 | kerryn
You should check the archives, there has been much written on this subject in the past. Asking about the correct chemistry is wise. It never ceases to amaze me how many people think ultrasonics will work without the proper chemistry. Without the rig
Electronics Forum | Sun Jan 23 03:23:09 EST 2000 | Rob Steltman
Hi We use a U-channel piece of high temperature silicon which is just pushed over the gold tabs before the soldering process. The silicon can be used over and over again. The advantages are that there is no mask on the board during the SMT process a
