Electronics Forum: advance (Page 166 of 243)

Re: Cylindrical diodes Missing during SMT process.

Electronics Forum | Tue Aug 24 04:05:15 EDT 1999 | Scott Davies

| Hello everyone, | We found many cylindrical diodes missing during SMT process. Could someone tell us how to prevent this problem? Is it effective to change the shape of stencil apture or reduce fan speed in reflow oven? Thanks in advance. | | Gyve

Re: Cylindrical diodes Missing during SMT process.

Electronics Forum | Thu Aug 26 04:22:26 EDT 1999 | JAX

| | | | | | | Hello everyone, | | | | | | | We found many cylindrical diodes missing during SMT process. Could someone tell us how to prevent this problem? Is it effective to change the shape of stencil apture or reduce fan speed in reflow oven? Than

Re: Electroless Tin Plating

Electronics Forum | Sat Aug 21 12:13:17 EDT 1999 | Brian

| I am being asked, by my vendor and Purchasing people about converting from Tin/lead pads on P.C.B's to Electroless Tin Plating. | Can any one tell me what I have to change in my SMT | process (paste, reflow, etc) If any? | I ran one P.C.Boar

Re: Bridge on BGA

Electronics Forum | Wed Aug 18 21:26:08 EDT 1999 | Dave F

| Yesterday as I was creating a profile on a plastic BGA using Conceptronics freedom 2000 rework station, I happend to discover that I was able to remove solder bridging from a plastic BGA. | | This is what I did. | | Created a removal profile, I h

De-wetting

Electronics Forum | Tue Aug 17 04:12:32 EDT 1999 | Scott J

Can anyone help on the subject of de-wetting during the spray coating process. We use PC29M Parts A+B spray coating material, Humiseal tapes and masking dots, Marigold supertouch V70N gloves and Concoat CM533 liquid masking material. We also use a Ko

Re: De-wetting

Electronics Forum | Tue Aug 17 13:32:13 EDT 1999 | Brian

| Can anyone help on the subject of de-wetting during the spray coating process. We use PC29M Parts A+B spray coating material, Humiseal tapes and masking dots, Marigold supertouch V70N gloves and Concoat CM533 liquid masking material. We also use a

Re: BGA device continuity testing of solder connections

Electronics Forum | Mon Aug 16 04:38:18 EDT 1999 | Earl Moon

| Hello | I am looking for help in determining a simple (software based) method for testing the continuity of individual pins on an SRAM devices packaged in BGA. Can you help, or do you know someone who can help? Or do you know of an internet resouce

Re: 20 mil qfp bridging

Electronics Forum | Fri Aug 13 12:52:17 EDT 1999 | Steve Schrader

| Hello | | Having a problem with bridging on 20mil pitch qfp, only on the lead groups where squeegee goes over width of apertures. Using MPM sp-200 semi-auto, chem-etch stencil, 9-10mil width opening | 100 durometer blade. Getting "tails" on deposi

Re: 20 mil qfp bridging

Electronics Forum | Tue Aug 17 10:41:13 EDT 1999 | Steve A

Wayne, Sounds like a gasketing problem. When the horizontal apertures are bleeding but not the vertical apertures. Could be poor underside support, HASL miniscus issues, masking or plugging issues, but what many people do not account for is that t

Re: Pick N Place UPS

Electronics Forum | Mon Aug 09 15:51:42 EDT 1999 | John Thorup

| Greetings, | | Would like to buy a 3 phase UPS for our Mydata TP11. | Been looking and generally, sales person's point of view, 10KVA @ $10,000.00 is what they recommend. Seems a lot to me??? | Called Mydata and suggested 2.2KVA per phase. | I wo


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