Electronics Forum: advances (Page 131 of 243)

What to measure at an AOI

Electronics Forum | Wed May 28 17:45:03 EDT 2003 | testing

Hi All, I have currently got several AOI Machines that I want to collect data from for some SPC analysis. However, can someone please guide me to what I can and should measure with this equipment such as Cpk etc, and if possible provide some method

Lead Free soldering profile for SMT

Electronics Forum | Fri Jun 06 04:52:21 EDT 2003 | kevyeoh

Hi all, I am just wondering is there any other Lead Free Standard Profile for IR reflow besides the standard provided by Jedec ? What if the profile that i use is different from the one provided by jedec ? Lets say the peak temperature for Jedec is

BGA inspection scope - Visual

Electronics Forum | Thu Jun 19 16:58:11 EDT 2003 | blundell

We can speak from experience, the Ersascope needs only 1.5mm to see along side a device and is the only system that looks low enough, the cheaper systems may be fine for normal packages but forget it for csp's, micro BGA's Also its the only system th

Flip Chip Underfil process

Electronics Forum | Thu Jun 26 08:49:21 EDT 2003 | caldon

Depends on your Material (Chemistry) and Machine. We use a hot plate with the material in an "L" patern. The Hot plate is used only in aiding the capillary action. Also, is time an issue?? Here is a good paper from Asymtek that was poster in Advan

Flex circuit assembly

Electronics Forum | Wed Jul 09 17:07:51 EDT 2003 | msjohnston

Like many others out there I am new to SMT assembly on flex circuits. In the past, we purchased flex assemblies manufactured from a sub-con. Now we will be building internally. Are there any guidelines when building products with flex circuits? Wa

MSD Rebaking Guidelines

Electronics Forum | Fri Jul 11 09:58:18 EDT 2003 | Chris

Good Day Everyone, We are a contract manufacturer. We are constantly receiving MSD components in consignment kits that are not sealed, not in the right bags or have no desiccant. When this occurs, we bake the parts per JEDEC J-STD-033A. We recently

Immersion Tin Tarnish

Electronics Forum | Fri Aug 08 06:44:33 EDT 2003 | Matt Kehoe

Emergency!!! We have a small run (5) of very dense boards that have an immersion tin finish. They were built in April/May and have a heavy tarnish appearance on them, smd pads and through holes. We are being asked to apply ssd to the surface mount pa

Feeder/Machine Maintenance Tracking

Electronics Forum | Fri Sep 05 13:00:40 EDT 2003 | cabjerk

Hi: How simple or complex do you want? We run PFS software, but for our Feeder Maint we used access and just wrote a simple pgm and tied it into our PFS. What PFS gives us is how often the feeder is change out and this is used to base a feeder PM

Printing On Aluminum

Electronics Forum | Wed Aug 20 09:15:10 EDT 2003 | John S

My company is developing a product that will require solder paste to be printed on a piece of cast aluminum. The surface of the casting is not completely flat. It has been recommended that one way to work around this might be to use a screen instea

PCB Inspection Station

Electronics Forum | Thu Dec 18 17:43:57 EST 2003 | JD

Good evening all, I have recently gotten rid of our old SRT rework station because of lack of use. Before dumping however I took the CCD camera and monitor in the hopes of turning it into a board inspection station. However, the camera and monitor


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