Electronics Forum | Thu Mar 02 09:13:07 EST 2000 | jacqueline Coia
Could anyone please tell me if there is a quick simple formula for working out the ideal SMD footprint for a 52 pin QFP using the dimensions specified on the manunfacturers component drawing. I know of the IPC 'SMD land patterns' standard, which I e
Electronics Forum | Thu Mar 02 04:23:49 EST 2000 | Alan
Hi, I'm trying to put together a directory of component manufacturers that offer a lead free alternative for their devices. If anyone knows of manufacturers that are producing these devices then it would be greatly appreciated if you could pass the
Electronics Forum | Fri Feb 25 05:42:17 EST 2000 | Istv�n Dominik
Hi, We should wavesolder a PLCC44 package. The PCB is under the design procedure now and we must specify the best parameters (the orientation (45 or 90 degrees) of the package on the PCB,the number, the positon and the size of the solder thief pads
Electronics Forum | Wed Feb 16 21:56:33 EST 2000 | JAN
Hello, I�m having some dificulty to have parts recognized on HSP 4791. I�ve already been this part recognized on HSP 4796, so I put the same component data on HSP 4791. But I didn�t get good results. Does anyone have an idea about what could be caus
Electronics Forum | Mon Jan 22 12:25:03 EST 2001 | dbonilla
Hi: I am looking for companies or consultants that can assists Manufacturing Technology Services ( Technology Alliance Division) to grow in advanced technology processes like BGA, Flip Chip, flex circuits, COB and others. I wish to know availability
Electronics Forum | Tue Jan 30 07:55:31 EST 2001 | ibi
I will have to process a PQFP 128 with a pitch of 0.4 mm. Given that the width of its leads are about 0.13-0.23 mm, i dread the worst when printing the solder paste. So, i would like to know if some people have yet test this type of fine pitch, what
Electronics Forum | Thu Feb 01 20:21:34 EST 2001 | huat
Hi, Currently, we use kapton tape to tape out the goldfinger at our area. We still experience solder at goldfinger area, suspected is from washing of misprint boards. Can someone advice me on what is the method being use to clean the goldfi
Electronics Forum | Tue Feb 13 06:31:48 EST 2001 | jackofalltrades
I have been tasked with the job of developing Fiber Optic Repair procedures, most importantly cutting and splicing. Cleaning and checking, we have procedures for already. Now for my question, does anyone know of a "How To" site that may be able to gi
Electronics Forum | Fri Feb 23 15:22:42 EST 2001 | micah
Can anyone recommend a good software package which can be used to create panel criteria from Gerber/Cad data. Needs to do more than step & repeat. Need to be able to define panel size, add panel fiducials, define breakaways and hole sizes, ability
Electronics Forum | Tue Mar 20 09:03:18 EST 2001 | moseschee
Hi, I'm looking for research/study done on solder shelf life by using accelerated aging process ( steam age or dry air oven bake at 150C & etc ) Perhaps you could help to advise correlation of all this acceleration test to actual solder shelf life
