Electronics Forum | Wed Apr 30 12:30:14 EDT 2003 | Guillermo
Hello, I would like to ask for cooments/advices about the inspection of small solder deposits inspection (aprox 4 mills). We tried with X ray and Scanning acoustic microscope but it looks like due to the small size, we could not be sure to get all t
Electronics Forum | Mon May 05 22:24:17 EDT 2003 | jlipton
We are investigating a system, using 2-D matrix code, that will identify and track every PCB throughout our factory, starting from bare board. As a low-medium volume manufacturer, would labels or laser marking be more cost-effective? How difficult is
Electronics Forum | Wed Jun 11 17:16:12 EDT 2003 | MA/NY DDave
Hi I had to poke around awhile to see what you meant. I think you were at an advanced level where IF he knew the MSL ratings of his devices he should constrain his profile within the component mfgs tests for exposure to various profiles, or at leas
Electronics Forum | Mon Jun 09 22:22:56 EDT 2003 | kevyeoh
Hi all, Now there's another question regarding lead free I want to ask. Suppose I want to qualify a SMT product for lead free, do I need to use a lead free solder paste or any other normal solder paste will do ? What are the impact of using a lead
Electronics Forum | Wed Aug 06 16:35:31 EDT 2003 | Carol
This is an old topic, but keeps coming up. Solderability and reliability issues with SMT gold plated terminations when used with tin/lead solder paste/hassle finish PWB. I need to know which standard (mil, IPC, J-STD??) tells you all about the probl
Electronics Forum | Thu Aug 21 16:14:40 EDT 2003 | jgregory
Does anyone out here remember the Advanced Research Technologies ISIS machine? It was fantastic at defect detection by seeing hotspots on difficult to troubleshoot boards. I know that Photon Dynamics bought out the ISIS technology from ART, but the t
Electronics Forum | Wed Sep 03 15:49:18 EDT 2003 | terrapinstation
From the equipment side in the last 10-15 years ? I suppose the whole push toward modular machines. Less floor space, increased capability in a single platform - speed of a traditional chip shooter, common spares, blah blah blah. Some of the recogn
Electronics Forum | Tue Sep 09 00:51:33 EDT 2003 | iman
everyone made good observations in the arena of improvements. being rather pessimistic today, I'd like to say the one core area of little (if none at all) improvement is the over-reliance of human (aid/non-aid) inspection of SMT output soldering de
Electronics Forum | Mon Sep 08 11:30:54 EDT 2003 | clarkk
A customer recently questioned our use of the EIA curves for derating SMT devices for increased ambient temperatures. The European method (CECC) is much more severe in derating power ratings of devices as temp increases, but there are differences in
Electronics Forum | Tue Sep 09 15:22:39 EDT 2003 | gdstanton
Anyone have any experience with immersion white tin over copper plating? We are seeing opens develop under BGAs after we bake and conformal coat. And when we lift the parts the pads are 60% of the original size. Need some advice on possible causes
