Electronics Forum: after (Page 11 of 656)

BGA failure after coating

Electronics Forum | Wed Sep 30 11:32:45 EDT 2009 | pbarton

What type of conformal coating are you using and are you allowing the coating to migrate under the device in question? If you are allowing the coating unbder the BGA the problem could be CTE of coating is much greater than that of the BGA balls/sold

BGA failure after coating

Electronics Forum | Thu Oct 08 08:15:39 EDT 2009 | kpm135

We've used both 1A33 urethane and 1B31 acrylic coating on our SMT assemblies with great success for many many years. This is with components of all shapes and sizes including a 9 ball micro-BGA. We apply the coating in every way imaginable and we hav

Bad wetting after reflow

Electronics Forum | Fri Apr 09 20:47:36 EDT 2010 | 89jeong

I think the oxidation on the pad happens easily but do not on Au plated pad.The reason may be caused by improper cleaning or Au plating thickness in plating process. But,before suspecting the pcb board, you need to check your process or used material

Solder height after reflow

Electronics Forum | Thu Dec 09 07:21:10 EST 2010 | scottp

You won't have 2 mil height because the solder doesn't remain brick shaped. It's a dome. In the past I tried doing some calculations using the formula for the volume of a spherical section and also tried using a simulation program that accounts for

warped boarf after reflowing

Electronics Forum | Tue Sep 18 12:47:33 EDT 2012 | mbnetto

Hi, Regarding to thermocouple placement, you should use a precision thin drill. Drill through the bottom of the board to the top as follows: One hole in the center of the part, preferably into one of the center balls, if available. One hole into the

warpage after reflow

Electronics Forum | Tue Oct 07 22:15:12 EDT 2014 | padawanlinuxero

How to avoid /reduce warpage in long length PCB & > _1.6MM THICK PCB. You need to put it in a fixture or pallet to run it in the reflow oven, most common material use here is durostone for the pallets that we run in the reflow oven, we use Durosto

Component drop after reflow

Electronics Forum | Fri Aug 23 02:29:16 EDT 2019 | sssamw

It seems because the soldering area is not enough, so the wetting force is small to hold the switch, remember >0.08g/mm2 for each part as in IPC standard. So, anyway, you need increase the soldering area to reduce weight/area number to below 0.08g

Solder balls after wavesolder

Electronics Forum | Wed Nov 14 20:28:24 EST 2001 | davef

Not to worry. Just run the boards through the cleaner. It will remove all the solder balls. The gross filter on your washer will collect all the solder balls. Coo eh? ;-) How to cure SM? Is your mask UV, er thermal? After learning the type, you

Tarnish Occuring after Washing???

Electronics Forum | Sun Jul 24 16:10:16 EDT 2011 | davef

As a shot in the dark response to a hopelessly vague question .... Back in the old days, we'd see corrosion of metal parts after DI water washing when our water was on the high-end of the resistivity range, usually after we received fresh tanks from

warped boarf after reflowing

Electronics Forum | Mon Sep 17 06:11:41 EDT 2012 | kq702

Hi I did a reflow on a laptop board and after the reflow the board is warped in the area I did the reflow in, and now the laptop screen does not turn on at all when I put it back into the laptop. Original problem was the wifi (I did the reflow more o

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