Electronics Forum | Wed Jul 10 22:32:46 EDT 2002 | redmary
i just find the gap inside the component from the cross-section, it indeed exists the interal crack, not solder joint crack. but why the failed capacitor is well after some time. and the other suspicion is the quality of the component.
Electronics Forum | Fri Jul 26 01:56:28 EDT 2002 | Dreamsniper
Here Downunder, I spoke with few SMT equipt suppliers and they said that many small companies bought machines since after the Sept. 11 incident. Info Tech is really down here but electronics manufacturing is rising at a slow rate but it's still hard
Electronics Forum | Sat Jul 27 14:30:56 EDT 2002 | Juan C. Ruiz
Do you have any picture or reference how can we determine black pad or plating contamination. I have heard about a lot of problems regarding BGA's and normally these components are only replaced or heat it and that's it ,after that the boards are wor
Electronics Forum | Fri Jul 26 18:28:51 EDT 2002 | blnorman
Actually this is for an automotive instrument cluster. From what I've been told back in the good old days we switched fluxes and after the car sat in the sun (and heat) a haze developed on the inside of the panel that was attributed to the flux.
Electronics Forum | Mon Aug 05 11:08:22 EDT 2002 | Claude_Couture
You must try cleaning the heads with a wet head cleaner. Dry tape cleaner just scratches your heads. Demagnetizer is good to use after a good cleaning.
Electronics Forum | Wed Aug 14 03:14:39 EDT 2002 | lloyd
Thanks for the replys'. So are you saying that SMD adhesive contains a flux agent?, because at this point in the process the boards have no solder on them at all, it's all done at a solder bath after the chips have been bonded.
Electronics Forum | Thu Aug 15 06:47:01 EDT 2002 | Steven
I am running a SMT production line but the defects are high. I do not want to encounter defects after the reflow whereby rework is costly and time consuming. Can anyone share with me the strategies of achieveing a low defect or zero defects product
Electronics Forum | Mon Aug 26 09:02:53 EDT 2002 | blnorman
Our requirement is 2 hours after printing before the board needs to go through the oven. Course we're in the humid south where on those 95%+ RH days we do get solder balling.
Electronics Forum | Tue Sep 10 22:29:01 EDT 2002 | scottefiske
Many times after initially cleaning in the solvents recommended by the paste/material manufacturer, a light white haze may still be visable...try using a soft bristle brush to remove the remaining residues. By this time the residues that remain will
Electronics Forum | Thu Sep 12 01:49:28 EDT 2002 | ck
Hi all, Any stencil opening recommendation for 20mils pitch mirco BGA. Currently, using 12mils round opening, 5 mils thickness. Seen to have weak joints as it crack after Ict testing. thks
