Electronics Forum: after (Page 146 of 656)

Very Low Volume BGA Assembly

Electronics Forum | Tue May 23 10:40:25 EDT 2006 | Chunks

Chris is right. You can do a good visual after placement if you have outline marks on your silk screen. That helps a lot. What size BGAs are you talking about. That would determine how critical you want to get with inspection.

Worth a read

Electronics Forum | Fri May 26 11:06:30 EDT 2006 | pjc

Thanks for posting this Patrick. My head has finally stopped spinning after reading that document. Unbelievable is all I can say.

SMT optimization and improvement

Electronics Forum | Thu Jun 01 20:58:25 EDT 2006 | ec

Hi Jack, The throw out is it after vision or before vision. Do u have any msn account.....using msn is much easy to discuss the issue with you.

SMT optimization and improvement

Electronics Forum | Thu Jun 01 21:13:48 EDT 2006 | jacksaria

Hello EC, Throw out is sometimes after and before. My msn account is j.saria@hotmail.com. regards,

Stencil cleaning

Electronics Forum | Mon Jun 19 21:35:35 EDT 2006 | davef

Ahne [?] You say, "There are almost as many ways to be successful with this as there are ways to do it wrong." What do you believe are the successful and wrong was to go about cleaning stencils after the run is finished (or temporarily interrupted)

Stencil cleaning

Electronics Forum | Wed Aug 16 13:31:30 EDT 2006 | a_laser

You can stop cleaning after a job when there is no more paste in the apertures. Under wiping should be done with a quality cloth and should leave no paste on the underside of the stencil (assures good contact on the next print and reduces chances of

RoHS Revolution? Pb Push-back?

Electronics Forum | Wed Jun 07 11:31:11 EDT 2006 | James

I think it's probably too little, too late, the horse has left the barn and our foot is stuck in the stirrup dragging us after him.


Electronics Forum | Tue Jun 20 06:47:53 EDT 2006 | Julien VITTU (STMicro)

hung copper balance is really critical in your case. in the same configuration we have specified less than 5% copper variation between top and bottom layer if you keep this rule, assembly will be ok, otherwise you will get a terrible warpage after

Justification on buying machine (Reflow/Wave)

Electronics Forum | Mon Jun 19 14:04:39 EDT 2006 | slthomas

Because some lead free solders are very corrosive to anything but titanium. Also "clean it very well" is kind of a crap shoot, isn't it? Did you get your solder tested for impurities and lead %age after you did the swap?

Black PAD

Electronics Forum | Mon Jun 19 05:00:17 EDT 2006 | YQ Deng

Thanks very much! In fact, "Black PAD" phenomenon have been found in our product, the total BGA came off PCB during drop test. if we apply the underfill to BGA after SMD process, Could the underfill add reliablility of product?

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