Electronics Forum: after (Page 226 of 696)

Re: Moisture free storage units.

Electronics Forum | Tue Mar 07 13:21:03 EST 2000 | Tuan Bui

Hi John, Aerofeed,Inc. has the "Dry box" nitrogen cabinets. 215-257-1152 and they are in PA. I purchased one last year and it has been doing a wonderful job for our operations. I use it to store BGAs and micro BGAs after baking. To reduce the cost, I

BGA Sphere Reflow

Electronics Forum | Thu Mar 02 15:12:50 EST 2000 | Robert Hartmann

To restate my question of earlier, if I have a .020" sphere before reflow, and my pad opening in the dielectric is .017", is there a rule of thumb to calculate the height of the sphere after reflow? We are using 62Sn/36Pb/2Ag spheres. This should h

Re: Solderability on Immersion Gold

Electronics Forum | Thu Mar 02 07:38:58 EST 2000 | Roni Haviv

Hello, I had experienced this kind of problem; Because the Au film is very thin (flash gold..) it is sometimes porositive and the Ni barrier below get Oxidation. After reflow there seems to be good solder fillets (visualy perfect!) but the leads wit

Re: solder balls and flux

Electronics Forum | Wed Mar 01 10:46:26 EST 2000 | Robert Hartmann

Kelvin, Thanks for the help. The actual opening size is .440 mm, but I think what you said makes sense. After discussing with the customer, it looks like it is the height which matters, more than the diameter. We have learned that the height of t

Re: Squeegee Blades

Electronics Forum | Fri Feb 18 16:08:35 EST 2000 | ScottK

John, As a supplier of squeegee blades, we ship them out in clear plastics tubes at the approximate length of the blade itself. The ends of the tube have simple slide-on end caps. After visiting many customers sites, I've found that most of them k

Re: Solder Beading under Cap...Need help

Electronics Forum | Fri Feb 11 08:51:45 EST 2000 | HMAL

Dear Masdi, Perhaps you should check again your screen print process. Small amounts of solder paste under stencil can cause your problems. This paste is from previous printed pcb. When printing next pcb this paste attachs to places that it doesn't

Re: automatic placement of pin through hole component

Electronics Forum | Sun Feb 13 19:57:59 EST 2000 | park kyung sam

hi. pascal your problem is mine. sorry. i have no experience about m/c for pihr. we use woman for stick pin ,sme connector after mounter. we also consider m/c just like you. what i want to let you know is that http://www.celtronix.com. bye

solder balls on high temp.solder

Electronics Forum | Mon Dec 11 15:12:20 EST 2000 | accuspec

we are using alphametals no clean 95sn/5ag CL775 paste. After reflow there are solder balls on the board. mainly are around the cap. We are using a conceptronic concept 60 air. There are 4 zones with 8 chambers. We are not sure what the profile

Re: Fine Pitch

Electronics Forum | Thu Nov 30 21:45:44 EST 2000 | Dave F

It's unlikely that anyone other than the biggest of whooses would think of 0.031" a fine pitch. I prefer 0.025" on tape with solder plated copper leads make in a shape that bears-up well after being driven over by a Mack truck, yet is compliant enou

Manual reflow using hot air.

Electronics Forum | Wed Nov 29 20:32:08 EST 2000 | irwanm

I'm new in SMT and the company I'm working with has already purchased SMFL-3000 manual pick & place system with hot air and we don't have reflow oven. We are now starting design SMT board. My question is, how we reflow the solder? After all component


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