Electronics Forum | Sat Jan 23 12:37:35 EST 1999 | parag palshikar
hi, i am working towards developing a no-clean process for a customer at contract manufacturing facility. the assemblies have gold fingers on them. these are masked to prevent from any damage to them during reflow soldering. the earlier process ut
Electronics Forum | Thu Jan 21 11:37:47 EST 1999 | Clifford Peaslee @ SMTnet
Wayne, I'm sure you noticed, but I inadvertantly made it very difficult to view the smt forum, after you come in to the admin corner. The "memory" has many benefits, but it is more difficult to maintain. I have fixed it. Any other problems please le
Electronics Forum | Wed Jan 20 03:31:28 EST 1999 | Patrick O' Herlihy
| Need recommendation for Automatic site cleaning machine for BGA rework. (after component removal). | | Advice on BGA reballing equipment/methods is needed. | | thanks a lot | | Lin | You can find some info on reballing at intels site http://d
Electronics Forum | Thu Jan 14 14:59:25 EST 1999 | Robert Culpepper
Does anyone have any data or experience with voids in Glob Top applications? We are working with a RF application and I'm trying to find information on RF performance characteristics and moisture absorption on a glob toped devices. We have determined
Electronics Forum | Sun Jan 17 03:17:38 EST 1999 | thebear
| What kind of equipment are you using to gauge the thickness of your stencil after it's used for some months? How to determin the condition of the stencil? Your input is much appreciated. | | Ken Mok, based in Shenzhen, China. | | | you ensure t
Electronics Forum | Mon Jan 04 15:07:27 EST 1999 | Tracy Hille
I am looking for information regarding post wave soldering of stranded wires into a circuit board using OA core wire solder. We do a final pass thru the cleaner after the hand soldering but I'm concerned about any OA flux residue that may have wicke
Electronics Forum | Tue Dec 29 04:11:59 EST 1998 | Richard Sin
I have an inbteresting problem on my N2 wave soldering lines. We have two N2 wave soldering line. Line A is old one and Line B is new. We found solder balling Phenomenon on PCB After soldering in the new N2 Atmosphere Wave Soldering Machine. In the c
Electronics Forum | Tue Dec 22 13:56:20 EST 1998 | Michael Allen
Yes, you can adjust the board clamp speed by adjusting the flow control valve on both air cylinders (front and rear). You may also want to adjust the software delay for the conveyor so that it starts after the board is completely lowered. | Once
Electronics Forum | Wed Oct 21 09:16:01 EDT 1998 | ULISES PENAHERRERA
I'M LOOKING FOR A SOLVENT TO MAKE REMOVING EPOXY FROM THE BOTTOMSIDE OF BOARD ON SMT COMPONENTS. THIS IS MOST IMPORTANT AFTER THE EPOXY HAS CURED AND EVEN RAN THROUGH THE WAVE. I'M LOOKING FOR A WAY OF MAKING THE REWORK PROCESS ON THE CURED EPOXY MO
Electronics Forum | Wed Oct 14 08:32:45 EDT 1998 | Earl Moon
| Dear Mr. Earl Moon | please give me all your information and pictures to know the reason of the voids formation caused by the HASL oxidation. | I am very interested to this experience. | | With Best Regards | V.Longobardo | | | | I will assemble