Electronics Forum: after (Page 26 of 656)

Re: Cleaning PCB's after routing

Electronics Forum | Sun May 24 06:02:33 EDT 1998 | Earl Moon

Hello, I am looking for suggestions for cleaning pcb's after the routing (fabrication) process. Keep in mind that these pcb do not have components intalled on them yet. We have considered pre-drilling the routing plunge points, but cost and ca

Re: white residue after wash

Electronics Forum | Sun Apr 05 18:59:15 EDT 1998 | Graham Naisbitt

Jaqueline There are so many variables in the electronic assembly manufacturing process involving more than 12 different chemistries, that it is impossible to easily identify and determine the nature and reason of such residues. GEC Hirst Research in

flux on PCB's after cleaning

Electronics Forum | Fri Jul 23 14:41:41 EDT 2004 | Steve Stach

Dear JSK, It sounds like the root causes of your problem are two fold. First, excessive heat will polymerize the abietic acid found in rosin forming neo-abietic diamers and polymers which are much less soluble than the parent monomer. There are

PCB Pad become brownish after IR reflow

Electronics Forum | Fri Sep 18 07:32:53 EDT 2009 | karthikthebest

I agree with Graham cooper's input. Also note that the brownish color is incremental w.r.t to number of days you hold after the thermal cycle(example: after the reflow)so try to complete all thermal cycles ASAP to lessen the discoloring.

discolored pbfree finish after bake and/or reflow

Electronics Forum | Thu Apr 20 22:14:51 EDT 2006 | raquel

hello! need ur inputs... if the Matte Sn pbfree finish of the component discolors AFTER having been exposed to bake, or, after reflow, will the base leadframe have any potential contribution to it? i know most likely suspects would be the plating pro

Baking planars after new BGA placed.

Electronics Forum | Mon Aug 14 08:18:24 EDT 2006 | John N.

Hi all, I work for a service company who do SMT repairs for a Blue Chip. The JEDEC standard doesn't seem to mention how long (if at all) you should bake a planar after placing a new BGA (after field failure). Any ideas? Thanks in advance. regards Joh

Contaminants after SMT which affect wire bonding

Electronics Forum | Thu Oct 05 07:23:34 EDT 2006 | Chris

Hi all experts, I have no background about PCB or SMT process. I am now encountering some issues after SMT - Unstable stitch bonding condition. I am now suspecting some contaminants remain on lead after cleaning. Therefore, how can I check th

Baking assemblies after ultrasonic water wash

Electronics Forum | Tue Jun 09 18:44:20 EDT 2009 | dyoungquist

We are using a water soluble flux which requires the assemblies to be cleaned in an ultra sonic cleaner after assembly. Is there a standard that specifies how long the assemblies need to be baked/dried after being submersed in a water solution for a

SMT chip component drop after DIP

Electronics Forum | Sun Oct 09 22:07:51 EDT 2016 | geniepro

I would like to ask after glue bonding is abalibity drop. I test by force equipment that it is very difficult to drop after reflow 2. Very due by DIP machine. I check after Dip many chip drop. I wonder the glue not qualify I am using IR 130. Could yo

The increased component height after reflow

Electronics Forum | Thu Oct 24 03:03:13 EDT 2002 | harriss

Hi: The component height will increase on the PCB after reflow soldering. But i don't know the accurate data of the increased height. Who can help me to get it? The stencil thickness is 5 mil we used. Thanks Harriss


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