Electronics Forum: after (Page 281 of 696)

Wirebond issues near SM

Electronics Forum | Fri Oct 30 09:19:46 EDT 2009 | cab

We have performed some EDS analysis and found high percent (approx 18% ) of Ni on surface of gold pad. Found Tungsten as well. This is an HTCC alumina package. Thickness of gold was confirmed and found to be in spec. We believe we are dealing wi

GSM2 and FlexJet heads

Electronics Forum | Thu Mar 18 18:52:29 EDT 2010 | edwaterfall01

There is a retrofit kit to take care of the head cable problem that you mention. The s/n with 7P in it represents what is called the 7 Plus level of the head. There was one more level after that (09) for the GSM. The better heads mentioned in the

High-end SPI and AOI?

Electronics Forum | Wed Oct 14 08:39:01 EDT 2009 | edmaya33

Anybody here work with Viscom S3088-II QS SPI? I heard this machine offers an ultra high speed of inspection and a state of the art features. We have been working with Orbotech P36+ but all we got is headache. A 2K US$ illumination board always fai

ICT pin maintenance standard - is there any?

Electronics Forum | Fri Oct 30 06:48:19 EDT 2009 | leadthree

Is there any official or in-official in-house standard for ICT pin maintenance on volume boards? Like, how many test can or should one pin do? Currently we just change when we get contact problems. That probably after 5000 tests or so. But I guess

oven profile issues

Electronics Forum | Tue Nov 17 01:05:26 EST 2009 | 89jeong

To monitor the reflow profile is very important. We are doing profile every week(Monday). Out customer asked us daily check at first. We checked daily but we changed the checking period from daily to weekly after discussing about it with our customer

SAMSUNG CHIP MOUNTERS

Electronics Forum | Thu Nov 19 08:29:42 EST 2009 | jdumont

We have had a 421 for a little over a year now and after the initial software bugs (we were one of the first users in the US i think) the machine is excellent! I would definitely recommend it. FWIW I was also looking at Juki but the feeder capacit

Bubbles on solder joint(after conformal coating curing)

Electronics Forum | Sun Nov 29 20:04:05 EST 2009 | prodivegsr

Hi sforman1, The chemical that i'm using is a solvent based coating humiseal 1B73. From my understanding,the UV curing is mainly for UV curable coating like the UV40. And the main advantage of using UV curing is for fast throughput and environment

Bubbles on solder joint(after conformal coating curing)

Electronics Forum | Mon Nov 30 09:05:47 EST 2009 | sforman1

totally wrong. a. I do not reccomend Humiseal UV products. My Dad started Humiseal. b. As the former VP of Dymax Corporation I know quite a bit about this subject. Contact Dymax in Torrington, CT and inquire about 984LV. c. You will definetly sleep b

Bubbles on solder joint(after conformal coating curing)

Electronics Forum | Wed Dec 02 00:31:37 EST 2009 | jlawson

UV40 for you info was developed in Humiseal EU and has been tested heavily against Dymax product. UV40 is a great product has many approvals from major auto and whitegoods makers.... I have seen comparisons UV40 to Dymax 984LV and Dymax comes out se

Piece parts reel counting

Electronics Forum | Thu Dec 10 11:07:48 EST 2009 | Lorena Flores

Hello! I think the point here to have a reliable counting system. No matter if it is given 5000 out of 5000 or 6000 out of 5000. What Jesus means is that there is a problem because the qty that the label says after the reel is counted doesn't match


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