Electronics Forum: after (Page 311 of 696)

Lead trimming

Electronics Forum | Thu Dec 28 21:28:36 EST 2023 | emeto

What type of PCB? What type of component?..... There are TH components that should not be trimmed at all. Some are sensitive to fractures, other times it is a bad design combination between board design and lead need trimming. Overall try to trim bef

applying ink to Panel of PCB's

Electronics Forum | Fri Jan 19 14:59:47 EST 2024 | carl_p

We used to use basic stampers years ago to define which shift & operator build which build before shifting to laser marking. You could use a stamper, failing that as the stamper worked I don't see why you couldn't use a basic stencil to mark what yo

Calibration problem FUJI NXT III

Electronics Forum | Wed Apr 17 02:13:22 EDT 2024 | acouto

Good morning, After the visit of an external technician due to the change of cables, when resetting the camera mark again when doing the inspection fails to check the calibration points of the conveyor. Is it possible that the technician has decalibr

Re: Missing SMT Chip Components

Electronics Forum | Mon Sep 13 21:18:29 EDT 1999 | Dave F

| Hi, | | Recently encountered missing components problem at the SMT process. | Among 13 chip components from the same part number mounted on the board, only 4 ( located in a same row and next to each other) were missing after post reflow. Checked t

Re: glue strangeness

Electronics Forum | Thu Sep 02 14:42:52 EDT 1999 | JohnW

| We are assembling double side pcs reflowing (smt) on top and by wave on bottom. | After first step (smt) we dispense glue on the bottom side putting one or two glue dots under small components and we cure in oven before wave. | After wave solderin

Re: glue strangeness

Electronics Forum | Tue Sep 07 12:51:02 EDT 1999 | Brad Kendall

| | We are assembling double side pcs reflowing (smt) on top and by wave on bottom. | | After first step (smt) we dispense glue on the bottom side putting one or two glue dots under small components and we cure in oven before wave. | | After wave so

Re: Micropax continued

Electronics Forum | Tue Aug 24 15:10:25 EDT 1999 | Earl Moon

| Again, I really appreciate the valuable input you all provided. Got my Air-Vac SRM4 machine Friday afternoon. Stored it safely in my cube over the week-end for safe keeping. Tried to find 220V single phase next to air with no luck yesterday. Electr

Re: Micropax continued

Electronics Forum | Wed Aug 25 10:49:42 EDT 1999 | Boca

| | Again, I really appreciate the valuable input you all provided. Got my Air-Vac SRM4 machine Friday afternoon. Stored it safely in my cube over the week-end for safe keeping. Tried to find 220V single phase next to air with no luck yesterday. Elec

Re: 20 mil qfp bridging

Electronics Forum | Thu Aug 12 21:08:39 EDT 1999 | ScottM

| | | | Hello | | | | | | | | Having a problem with bridging on 20mil pitch qfp, only on the lead groups where squeegee goes over width of apertures. Using MPM sp-200 semi-auto, chem-etch stencil, 9-10mil width opening | | | | 100 durometer blade. G

Re: Semi-Automatic Stencil Printing of Fine Pitch

Electronics Forum | Fri Jul 16 06:22:31 EDT 1999 | Wayne Sanita

Mark, I had the same peoblem. For my stencils i use a 15% reduction for the width of fine pitch leads only, as Earl said follow the 1:1.5 standard. We consider pitches of 32mil and under. We also clean the stencil every other board to ensure no caki


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