Electronics Forum | Tue Sep 14 21:56:34 EDT 1999 | KEVIN SIMPSON
| | Hi, | | | | Recently encountered missing components problem at the SMT process. | | Among 13 chip components from the same part number mounted on the board, only 4 ( located in a same row and next to each other) were missing after post reflow. C
Electronics Forum | Thu Jul 08 15:38:27 EDT 1999 | Earl Moon
| Thank you all for your replies. Thanks to your replies and backup from the IPC-SM-782A (section 3.6.3.2) and James Blankenhorn's "SMT Design Rules & Standards," the designer has agreed to provide adequate clearance between the via and the pad. |
Electronics Forum | Tue Jun 15 12:03:27 EDT 1999 | Dave F
| Has anyone had issues where bottomside double reflowed smt has fallen off in the wave when using voc-free flux? I have verified the hotter profile was not the issue by using an alcohol based flux with no problems.This voc-free flux is also not caus
Electronics Forum | Wed Sep 09 10:02:46 EDT 1998 | Earl Moon
| | | I am in need of possible causes and solutions to capacitors that are failing in the field. | | | Are there issues in our process that need to be | | | checked? | | | Some people said the problems are due to improper | | | storage. Others sa
Electronics Forum | Tue Aug 25 20:33:31 EDT 1998 | Karlin
| | | | Hi, | | | | Does anyone has experiences in reflowing Ceramic BGA and found solder wicking ? Solder wicking has the syndrome that solder being wick from the pad and ended up in the leads. | | | | We have rule out the possibility of not printin
Electronics Forum | Sun Apr 05 14:57:10 EDT 1998 | Earl Moon
| | | | | We are in the process of deciding whether to change a PCB product from a single board to a 3 up panel array. Could you please advise on the most effective removal design, either scoring or snap off, taking into account that material utili
Electronics Forum | Tue Apr 09 15:23:05 EDT 2002 | Alan W.
I have recently signed onto a company with very little board assembly experience. I am trying to develop a process control and continuous process improvement program for a new surface mount line, but have run into several people who are not really i
Electronics Forum | Tue Apr 09 15:24:10 EDT 2002 | Alan W.
I have recently signed onto a company with very little board assembly experience. I am trying to develop a process control and continuous process improvement program for a new surface mount line, but have run into several people who are not really i
Electronics Forum | Tue Apr 09 15:24:29 EDT 2002 | Alan W.
I have recently signed onto a company with very little board assembly experience. I am trying to develop a process control and continuous process improvement program for a new surface mount line, but have run into several people who are not really i
Electronics Forum | Thu Aug 15 15:44:46 EDT 2002 | dragonslayr
You can't control what you don't measure. You have provided very little detail other than post reflow costs are high. What defects are attributed to problems experienced prior to reflow? Are these random or recurring defects? You will need to put ea
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