Electronics Forum: after (Page 336 of 656)

MY12 tpsys shutdown

Electronics Forum | Fri Nov 18 07:09:41 EST 2005 | avalancher

What Bruce is referring to is a TPSys Data server. You can give it any name that you like (in Bruce's case, it must be called MyServ). I think what he is asking is after the reboot, does it have trouble reconnecting to the 'master' (whether that be a


Electronics Forum | Thu Nov 10 21:15:39 EST 2005 | davef

Years ago, there was discussion of making a "IPC-A-640" to define requirements for assemblies comprised of more than a circuit board assembly. We don't know what happened after that. As an alternative consider: Telcordia GR-78 - Generic Requiremen

Solder paste control

Electronics Forum | Fri Nov 11 04:40:18 EST 2005 | pavel_murtishev

Good day, First of all used solder paste should be placed in special container. It should be kept separately from �fresh� solder paste from the same jar. Limit paste usage period after opening the jar according to manufacturer�s specification. When

Inner Layer Separation from Barrel Wall - Too Much Heat?

Electronics Forum | Wed Nov 23 14:49:35 EST 2005 | moonshine

You sure have that right at least on this site. However, 35,000 other folks who really know me have other ideas. You folks have taught me the err of my ways. I told you, no more. After all, it's stupid to give stuff away to anyone. It's insane offer

What is the lifespan of your SMT machines?

Electronics Forum | Fri Nov 18 08:13:57 EST 2005 | Rob

I know plenty of 1980's CP3's & IP1's still out there, and the CP4's & 6's, IP2's & 3's are still going very strong after a decade or so & still commanding top dollar second hand. It depends on how well a machine is made & the type of engineering u

What is the lifespan of your SMT machines?

Electronics Forum | Mon Nov 21 13:54:19 EST 2005 | JF

Many companies don't think of the importance of the maintenance in the machines. I proved to my Boss that following the proper maintenance we were able to get more out of the machines, he did not do maintenance for 2 years till I came to this place a

Soldering with Electroless nickel

Electronics Forum | Tue Nov 29 22:32:51 EST 2005 | davef

The dissolution rate of nickel into tin is a lot slower than that of copper [into tin]. This results in a nickel-tin (Ni3Sn4) intermetallic that is only 0.25-0.75�m thin after a normal soldering process. The Ni-Sn intermetallic compound tends to be m


Electronics Forum | Thu Dec 15 12:10:07 EST 2005 | muse95

It should be the other way around. A Pb BGA ball will fully melt in a Pb free process, but a Pb free BGA ball will not fully melt in a Pb process, which means the Pb from the paste on the board will not fully diffuse through the ball. This leads to

BGA ball Separation

Electronics Forum | Tue Jul 25 12:14:39 EDT 2006 | russ

All my studies led me to believe that it was CTE mismatch of this package. Altera was of less than 0 help in this matter. The other possibility was an ICT test fixture. Unfortunately (?) the design life of this product was at end and the new design

How are you guys checking parts for RoHS compliance?

Electronics Forum | Tue Dec 13 12:46:15 EST 2005 | Slaine

We came across a manufacturer selling us a part that they Classed as RoHS compliant. On further investigations the part was found to contain lead, we use an XRF. The content was over 85% so was exempt and therfor compliant(HMP solder), until we solde

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