Electronics Forum: after (Page 346 of 656)

Invar Stencils

Electronics Forum | Thu Mar 29 12:05:38 EDT 2007 | cecil

OK, just finished our prototype build. PWB 7.5" x 10" 16 layers smallest pitch 17mil smallest BGA pitch 30mil (round apertures) smallest component 0402 total of 1492 placements 5 mil stencil foil (invar) Had numerous PQFN packages that always gave

Skewed components

Electronics Forum | Thu Mar 08 04:39:05 EST 2007 | stimpk

Hello, For the most part the ground side width should be reduced, but more than likly you are well into a run of built pcbs? Profiles may or not help in cases of the dreaded DPACK. No issues on any other areas or components so I'd stay away from t

Flux Removal Solvent

Electronics Forum | Fri Mar 09 06:04:18 EST 2007 | phil69

Hi, I am currently looking for a replacement solvent to remove RMA flux from Hybred Ceramic Substrates after reflow. We are currently using Dichloromethane in a Crest AVD500 wash. This solvent carries an R40 risk phrase, hence we are on a drive f

maximum number of reflow cycles for rigid PCB?

Electronics Forum | Thu Mar 15 12:33:50 EDT 2007 | ck_the_flip

To do a profile at most companies, if you don't have a scrap board handy, you'll use the already-soldered board that's already been through ONE reflow cycle. You spend time attaching T/C's with the aluminum tape - after all, the prep-work is half th

BGA rework

Electronics Forum | Tue Mar 20 05:26:32 EDT 2007 | CL

Hi Chrissie, BGA Rework from one CM's view: 10% process problem (printing, reflow, voids, etc) 10% component failure (no other problem found) 80% "The board does not work therefore it must be the BGA" This, of course, is exaggerated. My point bein

OSP Surface Finishes

Electronics Forum | Wed Mar 21 15:33:16 EDT 2007 | pjc

Not all OSPs are created equal. Some companies use N2 in their reflow oven to minimize oxidation during reflow. This is for double sided reflow and if wave or selective solder will be done after reflow. Get extra boards from the vendor to test. Run t

Pick & place

Electronics Forum | Sat Mar 24 17:55:25 EDT 2007 | colormaker

Dear forum We are in the market for a new /used machine pick place machine with 15 mil accuracy. We have been using a quad 4C for 7 years and it seems like each week we put more money into repairs. I have looking into several machines but it seem l

Pick & place

Electronics Forum | Wed Mar 28 20:35:52 EDT 2007 | darby

Quadalign is very similar to the Samsung. I would think that 4% dump on 1206 or even IC is way over the top. If you are certain that your component data is correct; I suspect that your z-axis centring height may be out of whack and that you are eith

SMD nomenclature

Electronics Forum | Wed Apr 11 07:25:21 EDT 2007 | Mark

Hi Piotr, We had the same problem before. Each engineer created his own name and after while nobady knows what it is. We started to use our own coding system of components using special code matrix. We use main features of componets like body shape,

Defect Per Unit (DPU) versus DPMO

Electronics Forum | Thu Mar 29 17:23:19 EDT 2007 | dphilbrick

All depends on the product. I say that because some stuff just isn't worth the effort, you other CM's know what I'm talking about. We do a review on every run after it is complete and there are many actions that can be taken. We always first focus on

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