Electronics Forum: after (Page 371 of 656)

Unsoldered gold pads on unleaded wave solder process

Electronics Forum | Mon Jun 18 04:21:22 EDT 2012 | brettrenishaw

Measured the pot temprature independantly from the software (268C/514F from moving wave). We are using Dross Inhibiter Tin/P Regenerator from BLT. Monthly sample checks are carried out on the solder bath and are all within limits. It will be hard to

Fuji CP IV-3

Electronics Forum | Fri Jun 22 13:49:27 EDT 2012 | johndoe0222

We recently made a backup of our FujiFlexa and Fuji give us a new License for the new installation. Then loaded the program into the machine and now its placing some of the components off. We retransmitted the Status and Proper then reloaded the

QFN aligment issues

Electronics Forum | Thu Jul 05 16:19:49 EDT 2012 | jorge_quijano

The PCB has 9 QFNs, distributed arround the whole board, but the ones in the edges are the ones with the problem. My stencil is 0.005" (I use to have a 0.006"), yesterday I realize after talking to my vendor that the stencil is manufactured in 2 step

question about reflow- it it ever a long term solution?

Electronics Forum | Tue Jul 03 16:59:18 EDT 2012 | dontfeedphils

Reflowing a BGA can be a reliable and long term fix, but it has to be done correclty, and using a heat gun and going in circles around the part is definitly not the right way to do it. To do it correctly you would flux under the bga, use a rework st

component stick at cover tape

Electronics Forum | Sat Aug 18 23:03:07 EDT 2012 | eadthem

We have had this problem in the past, On paper tape resistors(old stock from before i took over and forced rotation on everything) and on embossed (national semi parts, strings of glue pulled back like seat belts across the pocket.) For the national

Pad cratering

Electronics Forum | Mon Jul 23 05:40:58 EDT 2012 | franks

We are having a problem with a 601 pin BGA in that the corners of the BGA are lifting and taking the pads with them. Faults are not always seen straight away so we are not sure at which point the fault is happening. So far it looks as though flexing

how to avoid risk when buy used machine outisie your country?

Electronics Forum | Tue Jul 31 06:01:45 EDT 2012 | smtequips

hello everybody have you ever expericenced the risk when buy used smt machine from outside your country? Have you ever got the machine whose performance or function are not same as the descripted before?or you just got the scraps? Or you

Stencil Cleaning by hand

Electronics Forum | Fri Aug 17 09:32:36 EDT 2012 | jeremymek

I would advise against using IPA for stencil cleaning It may initially seem to produce good results but the way it works you end up with more problems. IPA is good at removing liquid fluxes but it dries out and cements solid fluxes to the stencils

Flying Probe, AOI

Electronics Forum | Tue Aug 07 04:51:54 EDT 2012 | mccabekev

We currently have a TRI TR7500 AOI machine we are happy with, and a Tescon flying probe on its way out. We are looking at getting at least 1 flying probe machine, if not an additional flying probe and AOI for another line. They are both used after SM

Ceramic BGA Balls Move Post Assy

Electronics Forum | Wed Aug 15 19:55:46 EDT 2012 | hegemon

If you are doing X-Ray post place and pre-reflow you should be good. Look elsewhere. Check profile - full lead free or hybrid? Be sure you are acheiving the required reflow temps and TAL required for the solder paste too. Check for belt movement

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