Electronics Forum | Mon Nov 20 16:40:16 EST 2006 | FredC
I stock nozzles that I made for this machine, but it has been a couple of years since I sold one. Even in the machines heyday we never sold more than a couple hundred nozzles at a time. One customer that has long since closed told me about an inciden
Electronics Forum | Mon Nov 27 17:23:44 EST 2006 | billwestiet
Russ, I felt the same way before I took the job doing this, and actually only took the job after taking a weeks vacation to look at the machine. There is certainly some truth to Chinese companies basing thier engineering on existing well known suppl
Electronics Forum | Wed Nov 29 01:25:53 EST 2006 | callckq
Dear All, I have 1 product that using solder bar from vendor called Asahi. After wave process, we found quite a sticky flux residue remain on the board. Eventually, have huge impact on our ICT fisrt pass yield(FPY). Current FPY is a the range of
Electronics Forum | Wed Nov 29 01:46:10 EST 2006 | hanocete
Hi! to all, Here in our company, we sometimes received BGAs and ICs that were packed poorly(not sealed), and no MSL level written to it from our suppliers, now we subject the material for baking before using it. We use J-STD-033B table 4-1 as our cr
Electronics Forum | Fri Dec 01 06:31:53 EST 2006 | CHITRA K
We use SMBJ5.0A - D0214A package component in our products.During production recently we have identified a seroius problem. The problem is, After reflow soldering the impedance becomes more / lesser and due to which the product does not work since th
Electronics Forum | Mon Dec 04 11:28:44 EST 2006 | samir
Patrick, Have you seen Al Gore's documentary on Global Warming, "The Inconvenient Truth?" It was okay, but I didn't like how Gore got political in a few scenes by slamming the current administration's environmental policies (or lack thereof...c'mo
Electronics Forum | Mon Dec 04 12:32:45 EST 2006 | russ
Made no changes to pip process for lead free. Everything stayed the same. just have to ensure that components can withstand the high reflow temp. incomplete hole fill is from aperture not being big enough. Many people forget that paste reduces in
Electronics Forum | Wed Dec 06 22:46:39 EST 2006 | SMTrework
Hi Dave, This is manufacturer applied epoxy / adhesive to minimize package "lifing" from chassis flexing and thius board flexing. I have seen the complete array area covered with this black or red epoxy in some cases (i.e. the underfill that I've
Electronics Forum | Mon Dec 11 06:29:04 EST 2006 | bwet
See before cversus after pics on BGA pad repair here: http://solder.net/services/services_pad-repair.asp The "how to" instructions for traces (and pads) is here: http://solder.net/solderingtips/PadandTrace_Repair_Solder_Tip12.wmv The skill level
Electronics Forum | Fri Jan 05 15:10:15 EST 2007 | Bob R.
How about, "Who is the person who'll be called in to spend the weekend getting the machine back up and running after a crash? If it's your home phone number on the maintenance supervisor's speed dial then it's in your best interest to have a back up