Electronics Forum: after (Page 411 of 656)

Re: Solder Paste Height

Electronics Forum | Sat Jan 06 21:56:54 EST 2001 | Greenman

While solder paste height is one possible process indicator, the other guys are right on the money - volume is key. One way to study overall paste volume is to measure every single pad, using a 3D laser analysis (see you next week for board 2)... OR

Re: Solder Paste Height

Electronics Forum | Fri Jan 12 19:36:36 EST 2001 | Brian W.

Cyberoptics makes a device called a Cybersentry. wonderful machine. Will work in line or off line. I used one in a former company. You program what pads and locations you want, and it can measure volume or height, and give you charts. You can en

Component Identity Help!

Electronics Forum | Sat Dec 30 23:39:25 EST 2000 | John Litva

I'm hoping someone on this forum can ID this component. This is a Piccolo board used in an 8 ounce micro electric helicopter. This board has (2) 5 amp speed controls and a single rate piezo gyro to stabilize the helicopter in flight. My father's P


Electronics Forum | Fri Dec 15 13:57:46 EST 2000 | genny

It is only after the reflow heating process that the peaks may show up, as the solder build up in some vias(due to HASL'ing) might drip down during reflow. I don't think I've ever heard of it being desirable to have a bare copper surface that will ox

Re: solder balls on high temp.solder

Electronics Forum | Wed Dec 13 19:40:38 EST 2000 | Jerry Wetzel, SME, EM/SME

Your profile must be precise, your stencil aperture sizes and shapes are very important, and the size of the pads on the boards should be very close to what the part manufacturer recommends. We had some trouble with hi-temp paste, and discovered tha

Re: Glue Witness Pattern Verifiable by FUJI???

Electronics Forum | Thu Dec 07 16:15:47 EST 2000 | JAX

It doesn't matter because on a dual dot both dots should be the same size. If one of the dots is to small and is not read by the vision system the dot is bad and the board will be skipped. You don't have to read the dual dot as a single item. With th

Re: baked on water soluble flux residue betwwen fine pitch comp.

Electronics Forum | Fri Dec 01 16:02:33 EST 2000 | Jim M

Thanks for your reply. I 've tried to clarify and answer your questions. The water soluble paste used is WS3060, type 4. The boards are sent through a inline di cleaner after reflow. There is a hot Di waterwash, rinse and then hot air to dry the wa

Re: Fine Pitch 48-pin TSOP

Electronics Forum | Fri Dec 01 00:37:20 EST 2000 | arminski...aka..Dreamsniper

I have a proto-type PCB with a 48-Pin Fine Pitch TSOP (0.5mm pitch) with a dimension of 19mm L x 11.50mm W x 1.10 Thickness. They are at the bottomside of the PCB and I need to wave solder the board. There are 8 of them at the bottom side. Are they o

Re: Process Characterisation

Electronics Forum | Sat Dec 02 21:21:11 EST 2000 | Murad Kurwa

Our NPI division is in a same category. We assemble small quantities and lot of different set-ups. I created a DPMO charting method using Excel that we use at Post Reflow, Post Wave and Final QC. In addition, we use x-r charts at screen print for con

Re: BGA Rework station

Electronics Forum | Wed Nov 22 15:09:52 EST 2000 | Finepitch Services

Chryzs, I've used AIRVAC and SRT (with their old adjustable 4 piece nozzle system). I also saw the APE Chipmaster... Here's my 2C after all that: Whoever claims he/she has a user friendly system is a big liar. The words are correct but the order is

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