Electronics Forum: after (Page 46 of 696)

Cleaning stencils after printing SMD adhesives

Electronics Forum | Wed Jul 11 18:32:34 EDT 2001 | Darby

Mark, We print and dispense with Amicon "D 125 F". Solvent used is Electrolube "SSS", which is also used for solder paste removal/pcb cleaning for misprints and rework both manually and ultrasonically. I like it - good stuff but at $25 AU per litre i

Re: Solder balls after wave soldering

Electronics Forum | Fri Jan 28 10:09:50 EST 2000 | mike d

Istvan, One possible reason for this is that you are using a water soluble flux in your wave solder machine. If you are and the boards are not pre heated long enough, the water in the flux does not evaporate before hitting the wave. When the water

Re: Solder balls after wave soldering

Electronics Forum | Sun Jan 30 03:06:50 EST 2000 | Roni H.

Hi, The major reason is that the flux is still "wet", you should fix the temp. profile (specialy preheat zone) so the evaporation of flux carriers will be better (anyway not to much !). Recommended: 1st preheat zone heating to ~70C , 2nd&3rd prehea

wrinkles solder joints after double reflow

Electronics Forum | Mon Mar 22 19:46:17 EST 2004 | pdeuel

The bottom side is going into reflow somewhare near melting point of solder. Reduce bottom side temprature. Get a good mole so ramp and soak tempratures can be checked on bolth sides of the PCB. The object is to keep bottom side parts from approching

wrinkles solder joints after double reflow

Electronics Forum | Wed Mar 24 08:36:58 EST 2004 | Evtimov

Hi! What exatly you do? Do you reflow the both sides of the board at the same time or you reflow your second side? I think in both cases you should decrease you bottom zones. If you reflow both sides - with 10-20C(F) If you reflow the second side - w

measument of paste thickness after Screen Printing

Electronics Forum | Tue Sep 07 09:53:37 EDT 2004 | rob

Hi Dhanashekar, I'm with Chris on this one, unless you are carrying out 0201 or ultra fine pitch placement it's a helpful but not critical tool. We found most print errors were avoided using the 2D vision on the printer, combined with plenty of aut

Black pad on BGA after removal

Electronics Forum | Thu May 05 17:15:46 EDT 2005 | russ

You got what I think someone has called a "cold melt". If you were to run your removal profile awhile longer you would not see this. Anyway, you don't have any issues as this is very common (at least in my experience). FYI I was thinking your oxid

PAD come off from PCB after Rework

Electronics Forum | Wed Apr 19 09:07:44 EDT 2006 | russ

Many times a pad that has no signal trace going to it will come off. It does happen from heat and time as noted before. Somtimes even the best rework person will remove them. If this can not happen in your situation I would recommend that you use

Baking planars after new BGA placed.

Electronics Forum | Mon Aug 14 20:37:03 EDT 2006 | davef

JEDEC defines packaging, matrix trays, tape and reel, and like whatnot. You need to be searching ANSI and IPC. Find these documents: * ANSI/J-STD-020, Moisture/Reflow Sensitivity Classification for Plastic Integrated Circuit Surface Mount Devices *

QFN - FCT failed after reflow

Electronics Forum | Wed Feb 07 09:37:48 EST 2007 | billyd

Had the very same thing happen the first time we used the small QFNs. The aperture for the thermal pad in the center needs to be cut in a grid form, either squares (with around a 10 mil spacing between openings) or circles, like a BGA pattern. Too mu


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