Electronics Forum | Thu May 27 12:19:35 EDT 1999 | Clifford Peaslee
Hello Smtneters, Due to the intolerable performance of the server that SMTnet currenlty resides, we have initiated a move to a new server (Dual PIII 550, 512Meg). There will be a down time, but we are not sure exactly how long it will be. I suspect
Electronics Forum | Thu May 27 13:22:31 EDT 1999 | Chrys Shea
| Hello Smtneters, | | Due to the intolerable performance of the server that SMTnet currenlty resides, we have initiated a move to a new server (Dual PIII 550, 512Meg). There will be a down time, but we are not sure exactly how long it will be. I su
Electronics Forum | Thu May 27 14:40:34 EDT 1999 | M Cox
| | Hello Smtneters, | | | | Due to the intolerable performance of the server that SMTnet currenlty resides, we have initiated a move to a new server (Dual PIII 550, 512Meg). There will be a down time, but we are not sure exactly how long it will be
Electronics Forum | Thu May 27 12:18:58 EDT 1999 | Clifford Peaslee
Hello Smtneters, Due to the intolerable performance of the server that SMTnet currenlty resides, we have initiated a move to a new server (Dual PIII 550, 512Meg). There will be a down time, but we are not sure exactly how long it will be. I suspect
Electronics Forum | Wed May 26 18:04:16 EDT 1999 | John Thorup
| After reflow proces in convection-IR oven we find broken body of SOT23 elements. There is no problems on other elements (SOIC, chip R,chip C, etc) | Where is the problem? | | Thanks in advance! | Check your profile at the site of cracked component
Electronics Forum | Wed Oct 03 13:48:42 EDT 2001 | rocco
hello every body !! We are assembling a new product with some kind of components like (soic)but this component has a metalic surface under the package that works like pin,is a ground terminal,and in the PCB you can see a pad, among the other pads,so
Electronics Forum | Wed May 19 11:50:32 EDT 1999 | Chris Nuttall
We care currently running into problems during our plug via process: At the moment we plug prior to soldermask (LPISM) using epoxy resin - plugging takes place from the component side - however we are seeing solderballs after solder level.This is cau
Electronics Forum | Tue May 18 17:07:57 EDT 1999 | Chrys Shea
Today I submitted a nomination for Cunli Jia for the SMTA Founder's Award. I would like to encourage other SMTA members to do the same. Now I know we're a bunch of engineers and not writers, but it will only take a few minutes to send a letter off
Electronics Forum | Sun May 16 03:38:49 EDT 1999 | Zambri
I'm running memory module product- SMT double reflow ( 12 modules per panel). I'm using the epoxy base solder paste in order to reduce the flux spattering problem onto the gold finger which could lead to the intermittent contact problem. I don't fa
Electronics Forum | Wed May 19 11:07:25 EDT 1999 | Glenn Robertson
| I'm running memory module product- SMT double reflow ( 12 modules per panel). I'm using the epoxy base solder paste in order to reduce the flux spattering problem onto the gold finger which could lead to the intermittent contact problem. | | I do
