Electronics Forum: after (Page 481 of 656)

MRP for small EMS - DBA Manufacturing

Electronics Forum | Thu Oct 30 14:46:33 EDT 2008 | rgduval

I've used DBA in the past. It's not a bad MRP software for the price. Though, your mileage may vary. We were using an older version of it at my last company, and there was no desire to upgrade. From a manufacturing standpoint (bill of material co

Black Pad?? (PICTURES)

Electronics Forum | Mon Oct 20 11:44:41 EDT 2008 | jdumont

Good morning all, we have been having some random intermittent connections on some BGAs lately on ENIG finished boards. Can you take a quick look at this picture (link) and let me know if it looks like a possible black pad occurrence? The picture sh

SN100C Selective Solder Voiding

Electronics Forum | Sat Nov 08 09:10:16 EST 2008 | davef

SN100 was designed for selective soldering and producing low levels of voiding. But thin barrel plating is a common cause of voids in wave and selective soldered connections, as you say. As a result, you checked the plating thickness and it was accep

SN100C Selective Solder Voiding

Electronics Forum | Tue Nov 11 19:41:06 EST 2008 | gregoryyork

Thats the problem residual residue from HASL fluxes Lead free especially are worse.Very hygroscopic and out gass and produce dewetting as well over wave soldered boards especially. Leave iron on blown joint and will after several seconds fizz and pop

Coating Brush Touch-up

Electronics Forum | Tue Dec 02 14:31:48 EST 2008 | dontfeedphils

Hey guys, just joined the site and I'm looking for some help. In our coating department we are running a Asymtek C-740 with a Jet and film coater. The coating that we are using is Humiseal 1B73 acrylic. The problem that we are having is that the C

SOT23s and paste + glue

Electronics Forum | Mon Dec 22 20:16:17 EST 2008 | davef

The first question in solving the "ol' SMT component loss after second-side wave operation" problem is: So, what makes you think the components actually came-off in the wave and not during some previous 'handling'? Putting that aside, we'll play thi

Water cleaning and Moisture Entrapment

Electronics Forum | Wed Dec 24 11:23:22 EST 2008 | childs

I can't seem to locate any information/concerns about moisture entrapment in IC packages on the promary side in a double sided SMT assembly using water soluable solder paste when soldering the second side. A typical process would assemble/reflow/cle

MPA III Power source

Electronics Forum | Wed Jan 21 10:27:27 EST 2009 | gidster

Ok. As you know the machines changed a bit after > 95 due to CE regulations. > > There are no drawing > on board/box level in Panasert > machines. > > However normaly i`ts the 100 volts > thats "shorting out" the machine and shuts it > down. C

Soldering problem with Au plating PCB

Electronics Forum | Sun Jan 25 17:40:16 EST 2009 | cuperpeter

Hello All, I have a problem with nonwetting Au finish after second cycle of reflow soldering doublesided boards. Solder nonwetted pcb pads (is wicked to component terminations) Either these pads or some of non component pads became discoloured from

Soldering problem with Au plating PCB

Electronics Forum | Tue Feb 03 16:42:50 EST 2009 | cuperpeter

Hello All, > > I have a problem with nonwetting Au > finish after second cycle of reflow soldering > doublesided boards. Solder nonwetted pcb pads (is > wicked to component terminations) Either these > pads or some of non component pads became


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