Electronics Forum: after (Page 506 of 656)

Re: Solder on GF

Electronics Forum | Tue Jul 13 19:00:29 EDT 1999 | JohnW

Hi All, Does any one experienced the solder on gold finger after reflow. Its about 5 to 8 mils diameter . We'd clean the entire screen printer, mounter & reflow as well, but doesn't help much. Mr Kong..... Solder on gold is a age old

Re: Solder on GF

Electronics Forum | Wed Jul 14 10:58:25 EDT 1999 | Upinder Singh

Hi All, Does any one experienced the solder on gold finger after reflow. Its about 5 to 8 mils diameter . We'd clean the entire screen printer, mounter & reflow as well, but doesn't help much. Mr Kong..... Solder

Re: Surface Mount assemblies IPC Standards

Electronics Forum | Thu Jul 01 16:57:14 EDT 1999 | JohnW

Could somebody tell me what means Leaching, ie: "Leaching of terminal end face exposing the ceramic"? Roberto: Leaching, according to the SMTnet Library of Terms: Leaching. Dissolution of a metal coating into liqu

Re: Surface Mount assemblies IPC Standards

Electronics Forum | Thu Jul 01 20:56:57 EDT 1999 | Dave F

Could somebody tell me what means Leaching, ie: "Leaching of terminal end face exposing the ceramic"? Roberto: Leaching, according to the SMTnet Library of Terms: Leaching. Dissolution of a metal coating

Re: To clean or not to Clean??

Electronics Forum | Sat May 29 16:56:26 EDT 1999 | Jeff Sanchez

I have always thought it to be a good practice to wash SMA's with water soluble paste (WS609) soon after reflow. Is there a time limit as to how long a board should sit after reflow before washing said board? For instance; processing a double-

Re: To clean or not to Clean??

Electronics Forum | Sun May 30 10:15:34 EDT 1999 | Vic Lau

I have always thought it to be a good practice to wash SMA's with water soluble paste (WS609) soon after reflow. Is there a time limit as to how long a board should sit after reflow before washing said board? For instance; processing a dou

Re: Heatsinks for surface mount devices - adhesive alternative!

Electronics Forum | Tue May 25 10:56:12 EDT 1999 | John Thorup

Can anyone steer me towards a supplier of heatsinks suitable for use on a PQFP 160. Before you shoot me down in flames, I know that I am not going to get much heat away from the die because of the plastic but the application is such that the bo

Re: vibration during solder reflow

Electronics Forum | Mon May 24 09:52:06 EDT 1999 | john thorup

Has anyone had any experience or data using vibration during the reflow process. We introduced a vibration device attached to the fixed rail on a Vitronics reflow oven. The reason was to prevent skewing on large PLCC devices. The process

Re: Intrusive reflow..from the bottom..????

Electronics Forum | Fri May 21 15:29:26 EDT 1999 | JohnW

Joe.. Sound's pretty neat trick..mind if I ask what type of comp's are on this board and the paste..? This baby (pig I think) has got a 244pin QFP right dam in the middle..!, so if ur flipin it 180 degree's are u using like a piece of Jot in line co

Re: BGA's - Re-ball -- How thick?

Electronics Forum | Tue May 18 15:36:18 EDT 1999 | Tony

What is the best way to re-ball a BGA? Who has the best system for doing it? I'm using our SRT rework stuff to reball in house - when necessary. Of course, we only do this for protos and test boards. We use a standard micro-stencil,


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