Electronics Forum | Tue Feb 08 10:33:26 EST 2005 | Dougs
have you had any reduction in aperture size though, we generally use a 6 mil stencil thickness with a 10% aperture size reduction for chip components and leaded components ( SOIC - QFP ) and a 1:1 ratio for BGA components without any problems.
Electronics Forum | Mon Jan 08 10:29:15 EST 2007 | jaime39
The water soluble flux residue is staying there because the rinsing temperature it may be too low. The flux needs about 130-140 degrees celcius to become soft. If you are using water soluble flux, as per IPC A 610 standards it needs to be remove comp