Electronics Forum: after (Page 521 of 656)

ICT Fixtures No-Clean Flux

Electronics Forum | Thu Mar 16 14:04:14 EST 2000 | Cartman

Greetings. My company has a VOC-Free no-clean wave solder flux with 4% solids. I have a number of questions as they relate to our ICT Fixtures. Currently, we're encountering the following issues: 1.) PM on probes....What is the recommended PM p

Placement accuracy

Electronics Forum | Wed Feb 07 20:57:31 EST 2001 | Kyle

What are you placing on this equipment? If you are placing flip chips, you need to have a glass plate test system to verify your machine is accurate and repeatable. If you purchase new equipment and plan to place flip chips or ultra fine pitch, it

solder balls

Electronics Forum | Thu Feb 08 09:07:22 EST 2001 | Hussman

OK, without knowing the specifics, why does everyone blame the oven? Most solder balls occur around R's and C's in almost every shop I've been to. The best place to start looking is the screen printer - not the oven. Sure the oven is the last proc

Substrate Au/Ni thickness

Electronics Forum | Thu Feb 15 19:41:38 EST 2001 | davef

What do you mean by "But after performing temperature cycle test, the former aging rate (from the shear strength ) seems faster than the latter."? Comments are: I can't recall having heard the term "precipitation hardness" [not that that means anyt

Wave Solder Immersion Depth, Contact length, Dwell Time etc.

Electronics Forum | Thu Feb 15 23:52:31 EST 2001 | Dreamsniper

Hey guys, I ran a couple of profile in our wave solder machine using wave optimizer and this is what i got: Parallelism = 0.0 Immersion Depth = 2.1mm to 2.4mm with varying immersion time from 1.1 sec to 3.1 secs. Contact Length = between 5.0 to 6.0

Metal foil is pulling away from the screen.

Electronics Forum | Mon Feb 19 14:17:21 EST 2001 | bschreiber

Hi Mark, If you are a user of stencils, you already know that there are literally hundreds of stencil manufacturers out there. If you found one that will allow such hot temperatures, I would be interested in learning who it is. However, I have only

laser or ink jet marking of pcb's

Electronics Forum | Wed Mar 07 20:37:38 EST 2001 | davef

I agree. The bar coded label you use should not be affected by the solder mask of the board. The label should have sharp contrast between the segments of the code to modulate the returned light and allow the reader to discriminate between light and

Need Expert Support - Popcorning

Electronics Forum | Wed Mar 14 11:51:24 EST 2001 | fmonette

Popcorning is the common designation for defects related to the moiture sensitivity of plastic molded components, like PBGAs. The plastic body of these parts will absorb moisture from the ambiant atmosphere on your factory floor. If a critical level

Bottom side process question

Electronics Forum | Thu Mar 15 15:36:39 EST 2001 | traviss

Don�t be afraid of the more standard doubles sided mixed process. Even without a chip wave it works, don�t get me wrong it works better with the chip wave, but even without chances are you will be spending more on the additional steps than you would

Gold Contacts

Electronics Forum | Fri Mar 23 09:28:46 EST 2001 | PeteC

Well, it's hard to say what it started out as, a smear, splash or ball cause the solder formation on the finger after reflow is spread out ya know. I looked at an archive for possible causes and one was printer operators with paste on their fingers.


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