Electronics Forum: after (Page 556 of 656)

changing from no-clean to clean

Electronics Forum | Tue May 21 17:16:51 EDT 2002 | davef

Larry, Yes, no matter how much you�d like to avoid using NC, you probably will have to start using the stuff, if the design [sales, in your case] types have their way. We can clean WS under 1mm and 1.25mm pitch BGA. For 0.8mm pitch BGA, we use NC.

stencil design software

Electronics Forum | Wed May 22 13:40:24 EDT 2002 | Hussman69

Boy, I step out for a bit and everybody picks on me (just joking). I believe I may have been off base a bit. Checking every bit of your stencil design is very good - I do that too. I calculate LXWXH and reduce or over print where needed, depending

Polarity for SMT Devices

Electronics Forum | Tue May 28 21:00:59 EDT 2002 | davef

That is the rub here, isn�t it? For those posting, it�s easier [but much slower] to start a new thread than to search the archives. [And posters could view their issue so unique and novel that it could never have been discussed several years earlie

Production Line Setup

Electronics Forum | Fri Jun 14 14:05:22 EDT 2002 | mjabure

Never try to convince an exec. staff to change manning policies using efficiency, it's a losing cause. Look at your audience, they probably all have MBA's which means they only look at the dollars and cents. To them those aren't production machines o

performance improvement

Electronics Forum | Thu Jun 20 18:56:31 EDT 2002 | stepheno

If you don't already have one, the best investment you can make in your case is a good thermometer/humidity meter. They are not at all expensive. Then record the temperature and RH about 4 times a shift. After a few weeks (maybe sooner) you can se

Remove,Re-ball then Re-use BGA safely !!!

Electronics Forum | Tue Jul 02 17:09:02 EDT 2002 | dason_c

Francois, thank you very much for your recommendation twice. Is it any harmful for my evaluation? The component will go thro the reflow after drying process and not just only check the weight. The evaluation will go thro the C-SAM as Dr. Shook doc

Voids in SMD reflowed solder joints

Electronics Forum | Tue Jul 02 02:50:55 EDT 2002 | ianchan

Hi mates, was going thru the IPC-A-610C Standards, and noted BGA voids stands somewhere between 10%-25% voids permissible in the solder "ball" bump, after reflow process. Was wondering, hypothetical case study, is there any specification for voids

Static Detectior for ESD program

Electronics Forum | Wed Jul 10 18:05:11 EDT 2002 | mikestringer

What have your experiences been with static meters for maintaining your ESD program? As part of our ESD program I am after an improved method of identifying risk items, or items not performing to specification. We use wrist and foot straps, ESD flo

Is Anyone?

Electronics Forum | Sat Jul 27 00:27:41 EDT 2002 | fastek

Cal- Your statement about Fuji owning the market in the 80's is not quite true. If you look at what was happening in those days...before CM's had any penetration, Panasonic was the big dog because they targeted the OEM's and crapped on the CM's. Mad

Key Production Indicators

Electronics Forum | Thu Jul 18 14:58:54 EDT 2002 | mark_susol

Well I'm sure I'm not the only who has this experience but even when things are going really well..you never realize 100% of what the machine says you SHOULD be able to do. So what I look at is the labor start time & stop time of the WO and the tot

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