Electronics Forum | Wed Oct 14 13:52:59 EDT 1998 | Bill Schreiber
Dear Sanjay, An important issue involved when stencil printing adhesives vs. solder paste is: How do you clean the stencils after printing? Do you need two machines? Two chemistries? Two waste streams? What are the potential environmental impacts an
Electronics Forum | Tue Oct 13 18:28:51 EDT 1998 | Graham Naisbitt
Upinder, Using IPA does not cause the residue, it simply exposes it. Given that all fluxes leave reisdues, it follows that these MUST be benign - but how do you know, and how do you control it. You are using flux to remove oxides and give you a go
Electronics Forum | Thu Oct 15 13:55:43 EDT 1998 | Steve A
Dave, The first step would be to learn to accept the residue. IPC class 2 has no problem with it. If that is not possible, I am not sure why a no clean is necessary- but I will take your work for it. Alcohols will dry out the residue, and turn it
Electronics Forum | Thu Oct 15 16:39:07 EDT 1998 | Dave F
Steve: I thought Kyzen products were "additives" to either aqueous or semiaqueous inline or batch machine cleaning processes. I'm trying to clean the no-clean residue from a few components that can not bear to see water. Can you use Kyzen products
Electronics Forum | Sun Oct 11 00:23:26 EDT 1998 | MIKE
| Came a cross an interseting observation/question. | I'll need to filter additional information and specifics to those whom may be able to assist me. But for now; | | I use a water soluble base organic flux manufactured by Kester (the exact soluti
Electronics Forum | Mon Oct 12 20:51:14 EDT 1998 | Eric
| | Came a cross an interseting observation/question. | | I'll need to filter additional information and specifics to those whom may be able to assist me. But for now; | | | | I use a water soluble base organic flux manufactured by Kester (the exac
Electronics Forum | Thu Oct 08 03:33:50 EDT 1998 | Thomas Blesinger
| | I am trying to find out, what possibilities I have, to print solder paste on a board, when the task is to have 120 Microns thickness for the biggest part of the board (85% of the real estate), and then have 250 Microns of thickness on the remain
Electronics Forum | Wed Sep 30 10:38:42 EDT 1998 | Earl Moon
| Anyone have ideas how to get MIL 50884 Qualification?. | | We are a small/mid sized Flex, rigid-flex circuit shop in Canada considering MIL Qualification. Is there any web site that we could check out? | | any advice is appreciated. | thank
Electronics Forum | Tue Sep 15 08:59:59 EDT 1998 | Chrys
| I am running composite fixtures on my wave solder machine and after about 500 passes each (1 month)they are showing serious signs of wear in that the composite surface is bubbling up and glass fibers are also starting to show. | The problem here
Electronics Forum | Fri Sep 11 17:23:00 EDT 1998 | Eric Miller
Hey Dave, sounds like your material is delaminating at a rapid rate, I would not recommend using them through your process, delaminating material has to go some where! When composite material is made, layers of fibre glass and epoxy resin are placed