Electronics Forum: after (Page 61 of 656)

What pressure is recommended to clean AMT boards after reflow

Electronics Forum | Sat Sep 08 09:44:43 EDT 2001 | davef

Your reply was NOT out-of line. You're correct and I'm wrong. I apologize. I'm sorry I referenced your name incorrectly and implied things about you that I didn't mean. I should have said KerryN, when speaking of the dark side.

What pressure is recommended to clean AMT boards after reflow

Electronics Forum | Tue Sep 11 10:13:58 EDT 2001 | davef

Yes, you cannot change the "subject" that you enter when first beginning a tread. This is what will appear on the Main Conference. You can change the very same "subject" as it appears when the thread is selected in one of the Forums with "edit" or

Thousands of TSOP or VSOP To be replaced after assembly

Electronics Forum | Tue Mar 19 08:19:19 EST 2002 | H. Koga

Dear all: For a dramatic design mistake, we have to exchange a VSOP chip on a few thousands of already assembled PCB's. This is in addition of removing 2 & adding another 2 chip components. What do you think is the best method, technique or tool co

Thousands of TSOP or VSOP To be replaced after assembly

Electronics Forum | Wed Mar 20 17:18:08 EST 2002 | alex_kirichenko

Hello everyone!! About hot air tool.... Most of the the brands will supply you with specific nozzel for the package to be removed, it will heat up leads only, so you don't have to mask anything (sounds like less work :) ) by the way I had to take

Gold surface contam after prebake 150C for 3 hrs

Electronics Forum | Wed Apr 07 10:10:00 EDT 2004 | ccl

thanks Dave, solder mask use is AUS 5 from Taiyo ink, solderability of the contam area is still pass the min spec. gold thickness is ~ 1 um and Ni layer is ~10um. can solder mask bleed cause contam? forget to tell the product is full body gold (FBG)

Urgent!! ... AI process after SMD Reflow Soldering

Electronics Forum | Thu Sep 15 08:33:14 EDT 2005 | pjc

Is not a problem, I've done it. Be sure the insertion tooling and cut&clinch tooling are set to proper distances from the board. If proper, no deflection of PCBA should be observered during AI. Obviously, your AI Operator must be more careful with PC

Urgent!! ... AI process after SMD Reflow Soldering

Electronics Forum | Thu Sep 15 10:00:28 EDT 2005 | slthomas

I'm curious about one thing. What kind of components are on the bottom, how many are there, and how are you processing (in particular how do you get glue and paste on) them? Edited to add: You shouldn't have any problems (assuming your tooling heigh

Urgent!! ... AI process after SMD Reflow Soldering

Electronics Forum | Thu Sep 15 11:16:20 EDT 2005 | pjc

Thanks Steve, good point about warped boards, which are common with doube-sided reflow. Centerboard support helps minimize on reflow. We did do modification to the workboard holders to ensure boards are secured. The boards where small enough that war

Use of solder paste after taking out from cold storage

Electronics Forum | Sat Nov 05 05:09:51 EST 2005 | ajay

we do keep out solder paste ready for next shift or for replenish. We specified a location to keep new paste ( only one container ) near stencil machine. As soon as that is use we put another container from freeze, we make sure that at specified loca

Use of solder paste after taking out from cold storage

Electronics Forum | Fri Nov 18 07:22:35 EST 2005 | avalancher

Moonman really needs to stop. I finally looked at his site, and it sucks. It is NOT informative, he has chosen horrible background and font colors (immediately got a headache). It is just some 'person' who thinks 'he/she' is an expert in this indust


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