Electronics Forum | Thu May 19 03:39:04 EDT 2016 | jpcwg
Design application software in resistance welding layer options to carry on the design, can put the resistance welding options this functionality, born PCB board factory to actual production of PCB design are window. we are professional PCB manufac
Electronics Forum | Tue Jul 07 10:25:03 EDT 2015 | swag
Dial indicator on a post/base. You might need a fine point tip to get between adjascent components and the BGA. Or... if you're real fance schmancy you could use a CMM if you have one.
Electronics Forum | Fri Jan 08 10:26:23 EST 2016 | junax
To all the experts, Is there any equipment (like coating uv lamp) that can detect flux residues on the pcba?
Electronics Forum | Thu Jun 30 03:14:34 EDT 2016 | andrzej
Looks like "black pad" issue. More about this here: http://www.ipc.org/feature-article.aspx?aid=Black-pad Definitly PCB supplier need to improve the process.
Electronics Forum | Mon Aug 22 22:40:52 EDT 2016 | twhoo
analysis report is as attached. Pls let me know what you think of the root cause of this issue? Can i conclude this is a black pad at thru hole ring with a root cause of contaminated gold
Electronics Forum | Mon Aug 22 23:22:29 EDT 2016 | twhoo
i also notice the carbon and oxygen is high on the defect? Why is that?
Electronics Forum | Wed Aug 17 17:17:45 EDT 2016 | davef
Warpage of a completed assembly is an uncommon requirement. I would ask whoever is laying that requirement on you to define how they would like you to measure it.
Electronics Forum | Wed Sep 21 09:07:49 EDT 2016 | johnb1712
We are looking for advice on removal of BGA components once urethane conformal coating has been applied and cured.
Electronics Forum | Thu Feb 01 12:22:26 EST 2018 | davef
When you talk about baking, I get the impression that you're talking about boards. Are you components dry also?
Electronics Forum | Fri Feb 02 02:05:49 EST 2018 | ameenullakhan
Hi Davef, Yes we have tried few component for cold baking for around 7 days around 50 to 60 deg C.
