Electronics Forum: after and zestron and white (Page 1 of 1)

Flux Designations and Composition

Electronics Forum | Mon Jul 12 11:35:27 EDT 2004 | Pierre RICHARD

Here are some answers to my questions after a good research. I also added more definitions that could help understand this esoteric language used in assembly, specially surrounding fluxes and their use. In blue italics are comments and extracts from

Water wash flux and cleaning

Electronics Forum | Mon Jun 19 09:47:23 EDT 2017 | georgetruitt

You have a lot to think about! What does the flux manufacturer recommend as far as specifics like water temp or pressure? Do they recommend high temp di-water a detergent or saponifier? Do you currently have a cleaning machine, batch cleaner or inl

ICT and specifying PCBA testing

Electronics Forum | Tue Nov 01 14:46:31 EDT 2011 | davef

Agilent TestJet Technology White Paper In the early 1990s, the testing of digital parts became problematical. Previous in-circuit test techniques sought to ensure a correct, functioning part by applying digital patterns, called vectors, to the input

"Gap" in completed solder joint between lead and pad

Electronics Forum | Tue Nov 28 09:21:58 EST 2006 | Michael Sanders

Is anyone aware of any articles, white papers, etc., that discuss the gap between the lead and the pad after a SM joint is soldered? In particular, I am looking for a formula for that "gap" for various components.

"Gap" in completed solder joint between lead and pad

Electronics Forum | Thu Nov 30 16:14:33 EST 2006 | darby

Maybe ask your customer where they got this idea from? It is possible they may have even got this idea from some white paper or article where they are trying to explain something else and show drawings with no solder between the pad and lead. It may

"Gap" in completed solder joint between lead and pad

Electronics Forum | Wed Nov 29 10:10:50 EST 2006 | M. Sanders

I'm sorry, Dave - I didn't make myself very clear. Yes, this space (not really a "gap") is filled with solid solder. For instance, if you place a gull-wing component in solder paste, after reflow, there will probably be a thin film of solidied solder


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