Electronics Forum: ag/pd and termination and reflow (Page 1 of 1)

Lead-free and Leaded solder in the same reflow

Electronics Forum | Wed Feb 01 03:38:56 EST 2006 | Jose Luis

Hi all, I'm working in Military Production and then, We have an exception about RoHS (LEAD FREE), but, because we use "normal" components, in this moments, a lot of components have LEAD FREE terminations, and we think that after of 1st July, we wo'nt

Lead-free and Leaded solder in the same reflow

Electronics Forum | Tue Jan 31 14:23:39 EST 2006 | samir

Chunks, For our lead-free eval, we had the same problem with "charred looking" solder paste up the component termination of one of the smaller discretes, coupled with excessive solder balling...this smaller part did see peak temps in the 240 range -

Re: Standard pad sizes for reflow and wave

Electronics Forum | Tue Sep 07 09:11:33 EDT 1999 | Dave F

| We've noticed that there are many different recommendations for pad sizes for various SMT parts. This seems to vary wildly from manufacturer to manufacturer for the same case sizes. Is there any standards that can used used to specify these sizes

LGA and Solderballs

Electronics Forum | Tue Nov 28 21:16:17 EST 2006 | davef

J Rose at EMPF says: The introduction of no-clean solder fluxes in electronics manufacturing has given rise to greater levels of solder balling simply because the opportunity to remove them in the wash process does not exist. They are typically cause

PB-Free HASL and Leaded Solder

Electronics Forum | Thu May 13 20:40:25 EDT 2021 | winston_one

Yes, we can't use pure Pb PROCESS. And as I say we will not use it anyway, as we have lead-free BGA's, LGAs, component with Solder Charged Terminations... It's became almost normal practice to solder it with leaded solder pastes. In this case peak re

Land patterns for 0612 and 0508 capacitors

Electronics Forum | Tue Nov 30 15:38:27 EST 1999 | Wendy Casker

Hi, I am looking for land patterns for 0612 and 0508 chip capacitors. Because they are not standard (yet) package sizes, i am having trouble finding a standard land pattern. (If you don't know what these are, picture a 1206 or an 0805 with the te

Re: Printing and Reflow with Ceramics

Electronics Forum | Thu Aug 13 07:53:40 EDT 1998 | Earl Moon

| | Couple of questions. | | 1) Are we talking alumina substrates as the ceramic material? | | 2) Are we co-firing gold as the conductors on the substrate surface? | | 3) In other words, is this a hybrid thick film circuit? | | 4) If so, how large or

Re: Cracking Capacitors and Solder Balls

Electronics Forum | Mon Jun 08 14:52:16 EDT 1998 | Gary Simbulan

| Earl, et al, | Boy things get old and cold around here fast. I promised more detail on my capactior problem and I thought I could drop something completely different in the same message and tell a tale of solder balls. | First the caps. We stil

DPMO calc and Overall Manufacturing Index (OMI) calculations

Electronics Forum | Mon Aug 27 19:24:00 EDT 2001 | sharafali

It has been mentioned that DPMO offers large advantages over First Pass yield calculations for measuring process performance!!regarding the same I have a few queries: What are the benchmarks for using DPMO as measures of process performance? How is

Re: Land patterns for 0612 and 0508 capacitors

Electronics Forum | Tue Nov 30 21:23:55 EST 1999 | cklau

hello; When we are doing component land pattern design , one thing will always be in our mind; that is the basic criteria or common land pattern design guideline for reflow and flow solder assemblies. For basic fomula in calculating resistors are:

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