Electronics Forum | Thu Feb 17 14:10:37 EST 2000 | C.K.
I'd have to agree with JAX here. This forum is intended to be a "Technical Bulletin / Newsgroup" and nothing else. Truthfully, these posts of the "old-timers" announcing their departures is getting..well.....OLD. I hate to see the Old-timers leave
Electronics Forum | Wed Mar 07 20:37:38 EST 2001 | davef
I agree. The bar coded label you use should not be affected by the solder mask of the board. The label should have sharp contrast between the segments of the code to modulate the returned light and allow the reader to discriminate between light and
Electronics Forum | Wed Mar 21 19:39:06 EST 2001 | davef
Thank you for the contributions you've made in this thread. May be setting people free to be involved in other areas is the answer. Situations that have me grinding my teeth are: * The head of Purchasing drop-ships a reel of resistors to a burn-in
Electronics Forum | Thu Mar 29 15:29:11 EST 2001 | johnw
measuring Paste volume or at least paste height is an essencial part of any SMT process. You've got to control those input's.... Paste volume determines how much solder is available for your joint so theres a direct to joint reliability / PCB reliabi
Electronics Forum | Tue Nov 28 18:24:45 EST 2000 | rabell
When the original material was developed, we worked with a team of industry experts from a minimum of four different companies. The material was validated by them, down to the last test question. So this has not, to date, been a particularly thorny
Electronics Forum | Thu May 24 09:11:12 EDT 2001 | Grant Petty
Hi, I would agree. We purchased a TP9 just the slow machine, but we were a small company at the time, and it worked fantastic. Almost no maintenance, and it's a dream to changeover. The serivce in Australia is also very good, but that does not appl
Electronics Forum | Tue Jun 05 10:31:40 EDT 2001 | raton
I am glad someone in education is getting a clue. I thank you for caring enough about education to ask some great quesstions. My brother-in-law got his Phd a few years ago and teaches at the college level, he agrees with many out there that if educ
Electronics Forum | Mon Jun 25 20:39:08 EDT 2001 | ianchan
Hi mate, no complete info given from what i see, so just some humble comments, mayhaps you review : 1) PCB pad finishing - Copper+nickle plated? coz if so, nickle is a KILLER to good solder wetting. what we did back here, was to HAL coat the nickle
Electronics Forum | Wed Jun 27 21:05:48 EDT 2001 | davef
BGA Cycle 1: solder ball attach. BGA Cycle 2: BGA attach to board. BGA Cycle 3: BGA removal from board. BGA Cycle 4: BGA pad dress. BGA Cycle 5: BGA ball replacement. BGA Cycle 6: BGA re-attach to board. Board Cycle 1: BGA attach to board. Boar
Electronics Forum | Mon Jul 02 20:13:41 EDT 2001 | davef
We agree with Wolfgang. Adding points along his line of reasoning: * Also consider placed component prescience. Sometimes, a mis-pick results in paste on the nozzle, which leads to the next component being stuck on the nozzle and not placed, which
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