Electronics Forum: ags (Page 1 of 55)

Re: Silver Inclusion In Solder

Electronics Forum | Wed Aug 23 16:46:52 EDT 2000 | Dr. Ning-Cheng Lee

Comparing 62Sn/36Pb/2Ag with 63Sn/37Pb, addition of 2% Ag introduces two major advantages. The first advantage is grain refining, and the resultant better fatigue resistance. The second advantage is a wider processing window on Ag metallization. Pres

Reflow Profile ENIG Vs. Immersion Ag

Electronics Forum | Wed Mar 23 12:45:24 EST 2005 | jdumont

Any reason why you would switch to Immersion Ag from ENIG? I am also considering the use of Immersion Ag (switching from good ol 63/37). Are there any papers on the benifits/problems of ENIG vs Immersion Ag?? Thanks in advance JD

Ag Saturation in SAC solder Paste

Electronics Forum | Thu Dec 16 16:28:51 EST 2004 | Indy

Hi, We are using Sn/3.0Ag/0.5Cu solder paste on Pd/Ag pad metallization in one of our application. Could someone provide me information on the following: 1. How bad is the Leaching of Ag in SAC alloy and how it can be mitigated. 2. During reflow so

Immersion Ag

Electronics Forum | Mon Aug 19 23:12:24 EDT 2002 | jason

Hi Andy, Do u also face tombstoning and cold joints when using Ag immersion pcbs ???

solder paste(SnPbAg)

Electronics Forum | Sat Aug 02 06:40:51 EDT 2014 | madhuranatha

Will there be any issue if soder paste of SnPbAg is used for airborne application (PCB)

Palladium Silver surface finish

Electronics Forum | Tue Aug 24 13:45:17 EDT 2004 | Indy

Hi, I am trying to assemble a LTCC component with Pd/Ag surface finish on to Sn/Pb/Ag solder and Sn/Ag/Cu solder. I am passing it through a reflow. I have observed poor wettability at the solder-pad joint. Does anyone have information regarding th

Palladium Silver surface finish

Electronics Forum | Tue Aug 24 13:47:14 EDT 2004 | Indy

Hi, I am trying to assemble a LTCC component with Pd/Ag surface finish on to Sn/Pb/Ag solder and Sn/Ag/Cu solder. I am passing it through a reflow. I have observed poor wettability at the solder-pad joint. Does anyone have information regarding th

Palladium Silver surface finish

Electronics Forum | Tue Aug 24 13:47:16 EDT 2004 | Indy

Hi, I am trying to assemble a LTCC component with Pd/Ag surface finish on to Sn/Pb/Ag solder and Sn/Ag/Cu solder. I am passing it through a reflow. I have observed poor wettability at the solder-pad joint. Does anyone have information regarding th

90/10 & Lead Free Solder Balls

Electronics Forum | Mon Mar 26 10:40:14 EDT 2007 | solderiron

WaveroomPlus can offer the following Sn95.5 Ag3 Cu0.7 Sn95.5 Ag4 Cu0.5 Sn96.5 Ag3.0 Cu0.5 Sn97 Ag2.5 Cu0.5 Steve@waveroomplus.com

Solder paste Density

Electronics Forum | Wed Aug 13 22:23:24 EDT 2008 | davef

8.4 * SAC305 => 7.36 * Sn-3.5Ag => 7.5 * '....in' [96.2Sn-2.5Ag-0.8Cu-0.5Sb] => 7.39 * Sn-4Ag-0.5Cu => 7.39, 7.44 * Sn-3.8Ag-0.7Cu (Multicore solder) => 7.5

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