Technical Library: aim 264-5 flux leaching issues (1)

A Study of Lead-Free Solder Alloys

Technical Library | 1999-05-09 14:14:51.0

With the ongoing concern regarding environmental pollutants, Iead is being targeted in the electronic assembly arena. This paper highlights lead-free solders and the different combinations of elemental makeups.

AIM Solder

Express Newsletter: aim 264-5 flux leaching issues (757)

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Surface Mount Technology Association (SMTA) |

. August 4 - 5, 2020 Symposium on Counterfeit Parts and Materials-Tabletop Exhibition August 5, 2020 Ohio Expo & Tech Forum August 18, 2020 Heartland Expo

Surface Mount Technology Association (SMTA)

The Last Will And Testament of the BGA Void

Heller Industries Inc. |

. These voids are the result of assembly process issues and do not have material or design root causes. Macro voids are due to assembly variation that can be eliminated with matched material and consistent process parameter selection/control

Heller Industries Inc.

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