Electronics Forum | Thu May 21 20:18:10 EDT 1998 | Earl Moon
| Y'all: IPC set-up a site addressing the environmental issues of the printed circuit fabrication industry. Some of it is interesting and applicable to the assembly business as well, even though not aimed directly at assemblers. IPC has recently t
Electronics Forum | Wed Jan 30 08:30:33 EST 2002 | seto
Hello Dave, Mechanically the conection between the component pad and PCB pad is good (the solder joint is very strong). The problem is associated with poor contact after the use by the customer (vibration, temperature, etc). You can see the pictures
Electronics Forum | Tue Apr 09 07:41:08 EDT 2002 | johnw
Craig, it depend's n what you want to look at. In term's of te gran structure of the solder jont that's formed when the joint is cooling so you'd want to monitor the temperature drop from the peak or say 215dg C for ref down to probably about 150 an
Electronics Forum | Thu Nov 28 09:51:37 EST 2002 | davef
I got here before the experts did. Underwriters Laboratory Incorporated is an organization located in the United States and is purely concerned with product safety performance. UL operates laboratories for the investigation of materials, products,
Electronics Forum | Mon Apr 07 09:52:07 EDT 2003 | kmorris
I have just started an assembly which uses a 16 mil pitch QFP. We ran on Saturday, using a type 3 solder paste. (working Sat's really sucks) We really struggled with paste release after the stencil sat for 15 minutes without printing. Apertures clog
Electronics Forum | Wed Jun 25 18:17:48 EDT 2003 | Brian W.
Water soluble pastes generally work best with a ramp-to-spike reflow profile. Check your paste manufacturer's recommended profile. There are many factors that impact your profile; board thickness, component density, buried thermal masses, board si
Electronics Forum | Wed Oct 08 08:30:21 EDT 2003 | christ
Hi Dave: I'd second you.Thanks for your effort and can you give me the hints about correct reflow profile for soldering PCBA.I doubt there was something problem during reflow,I found there were some flux residue left on the PCBA after reflow by th
Electronics Forum | Wed Mar 24 10:04:09 EST 2004 | Marc Apell
183C, 60 +- 15 seconds). The quesiton to use a straight ramp or soak profile comes down to the product your are soldering. The key is to get the whole assembly at the same peak temp (minimized delta) and same TAL for effective formation of the so
Electronics Forum | Tue Jul 13 16:35:25 EDT 2004 | Richard
Sounds like your Si plalladium finish has oxide on it from the firing or sitting around too long. I used to assemble LTCC and have had plenty of dealings with this matter. The best and easiest is to get an active type flux and solder paste. AIM makes
Electronics Forum | Mon Aug 30 15:41:35 EDT 2004 | Frank
Hi, In 2006 we will need to produce Lead free PCB and for now it's hard to get answer to my questions. I'm from Canada and the PCB vendors we actually have are not ready to produce Lead Free PCB ( HASL Lead Free ). For sure OSP (Entek) is not good
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