Electronics Forum | Tue Dec 26 10:54:37 EST 2006 | yusufgomec
We use hot air leveling (HAL) process in pcb production. HAL process is 3 steps. �n 1. step flux. 2. step is HAL. And 3. step is rinsing. As you know there is mustn't any flux after rinsing operation. Our flux chemical is water soluable. But there ar
Electronics Forum | Fri Jan 12 19:49:07 EST 2007 | stepheniii
I think she might be more on track about the air flow. I would think they not only have thermal mass but also emit thermal energy well which would add to the dificutly of removing them. I think a Dpak would have more local thermal mass than the shie
Electronics Forum | Wed Jan 31 17:01:34 EST 2007 | rw
I'm not that concerned about the solderability of the motor. Our customer is concerned about the outgassing of the conformal coat effecting the motor brushes. Silicone will break down into SiO2 and SiC will result from a spark between the brushes a
Electronics Forum | Thu Feb 08 22:54:20 EST 2007 | davef
pcbatech: You say, "another alternative is for moderators to periodically check the forums and delete spam, and the accounts." Roland is saying that the moderators have checked and deleted hundreds of spam postings in the past couple of weeks. The
Electronics Forum | Wed Feb 14 14:16:25 EST 2007 | branman5
We are a pcb manufacturing facility and we have a question. We wash our boards in a metal wire rack that has latex � inch tubing connected to it so the pcbs do not move from water or air flow. It acts as a buffer between the wire cage and the pcb. Ca
Electronics Forum | Thu Mar 08 15:21:43 EST 2007 | pima
To be honest this product its only a part of bigger PCB, so we have only substrate with 3 FETs on it so no other components at substrate occurs and all substrate are staying at metal fixture. WE have already window pan aperture. WE producing this pro
Electronics Forum | Wed Mar 14 12:06:15 EDT 2007 | Oswaldo Rey
There is an approximate 1W dissipation and has a 2 sq in area below part on solder side as a heat sink, vias are to physically conect this solder side area to power pad, so its necessary to use an adequate amount of paste. I really don�t think it has
Electronics Forum | Wed Mar 21 15:33:16 EDT 2007 | pjc
Not all OSPs are created equal. Some companies use N2 in their reflow oven to minimize oxidation during reflow. This is for double sided reflow and if wave or selective solder will be done after reflow. Get extra boards from the vendor to test. Run t
Electronics Forum | Wed Mar 28 11:27:32 EDT 2007 | jmelson
Hello, I was the guy asking about doorway size for a Philips CSM84. Well, we cut the doorway using the best info we could get, and managed to get the machine inside with only a few scratches on the paint! Still no door, hopefully the fabricator wil
Electronics Forum | Thu Apr 12 13:04:47 EDT 2007 | slthomas
Handling requirements of all classifications of moisture sensitive devices is found in J-STD-033. It really isn't an issue for most parts unless they're going to reach reflow temperature again, which is unlikely unless you're removing a nearby compo
