Electronics Forum: air (Page 166 of 257)

BGA Rework

Electronics Forum | Fri Apr 21 23:17:29 EDT 2006 | SD

Well, my first thought is that you need to consider lead-free rework. Depending on the alloy, some stations may not be able to reach the correct temperature. The best stations I have seen have a prism & shows both the pads and the BGA on a single v

Nitrogen purity requirments

Electronics Forum | Tue Jul 04 19:37:05 EDT 2006 | two cents

100 PPM or 99.99% purity is sufficient for any soldering application. There are a number of manufacturers that make PSA style nitrogen generators that are great systems for electronics applications. They are low maintenance and will pay for themselve

Reflow profiling Units

Electronics Forum | Wed Sep 13 10:31:14 EDT 2006 | CL

Hello Brad, We are running the Slim Kic 2000. We have found the predictions to be fairly accurate as long as the suggested change is within 20 degrees of the original recipie. As a test I ran a board with the wrong profile. The predictions got me wi

via tenting and pluging

Electronics Forum | Fri Nov 03 07:28:27 EST 2006 | davef

Via filling methods are: * Tenting * Plugging * Capping * Flooding Tented Via. A via covered with dry film soldermask; the via is not filled. When tenting from both sides there may be issues with trapped air that expands during mass soldering. Plug

DROSS in Wave

Electronics Forum | Sat Dec 02 11:35:30 EST 2006 | davef

Best dross remover is to not produce dross. Search the fine SMYnet Archives for previous discussions Dross will not increase signicantly * Another story, that lead-free solders will generate a greater volume of dross than conventional materials, is

maintain glue size

Electronics Forum | Tue Dec 19 20:54:52 EST 2006 | Guest

Your experience is quite different than mine. At continues dispensing,I noticed that glue dispense volume increase as the material in the syringe decrease. My machine is using air time pressure pump. This is normal for this kind of pump since ai

Solder paste handing

Electronics Forum | Mon Jan 15 06:18:50 EST 2007 | CL

Good Morning Stephen, 1) Most solder paste manufacturers recommend a 2 hour temperature stabilazation period. Solder paste should not be opened and exposed to ambient air if it is still cold. 2)Manufacturers do not reccomend mixing old and new paste

Ni/Au > Immersion Tin/Silver PCB finish

Electronics Forum | Thu Feb 22 20:34:25 EST 2007 | davef

This [ http://www.smtnet.com/library/index.cfm?fuseaction=view_article_html&file=no_hasl ] describes HASL [hot air solder leveling], as well as other common types of solderability protection. It goes on the discuss the impact of the use of these coa

Reduction of solder paste usage

Electronics Forum | Wed Mar 14 09:44:06 EDT 2007 | Cmiller

We use cartridges, that way nobody can mix back in paste off the stencil and no air can get in period. Any paste that is still good to use when removed from a stencil at the end of a job is put into a small pink zip-lock baggy with the date written o

Reflow oven profiling - frequency ???

Electronics Forum | Thu May 17 19:21:39 EDT 2007 | diesel_1t

We are currently using Oven Rider (ECD) to "verify" just the conduct of the peak temperature; we define which product is the higher runner for this line and then with the settings for this product (already profiled with thermal couples attached to th


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